GORE® Thermal Insulation for 5G Antennas
Enhance user experience with GORE® Thermal Insulation for 5G mmWave Antennas. Optimize heat management with minimal signal interference.
Reduce 5G Antenna Hot Spots with Thermal Management That’s Better Than Air
GORE Thermal Insulation for 5G mmWave antennas fits on top of antenna modules to prevent surface hot spots with minimal RF interference. It is compatible with commonly used Qualcomm® modules and custom shapes. This insulation reduces surface temperatures, maintaining 5G signal duration and enhancing the user experience.
*Qualcomm is a trademark of Qualcomm Incorporated.
Hotspot Reduction
- Reduce heat flow by 23% with thermal conductivity at 0.020 W/mK compared to an air gap at 25°C (0.026 W/mK).
- Place GORE Thermal Insulation for 5G antenna in front of the antenna to prevent surface hot spots.
- Redirect heat to the back side of the module where graphite can spread heat without interrupting the 5G signal.
Signal Integrity
Ensure minimal signal loss across mmWave frequencies with a low dielectric constant.
Fewer Dropped Signals
- Extend the duration of 5G mmWave signal transmissions before needing to throttle.
- Prevent the antenna module from touching the case with an electrically-insulative barrier when there are small air gaps.
Easy to Fit and Install
- Choose from 6 different thicknesses, available in custom shapes or designed to fit the most commonly used Qualcomm® modules.
- Replace a thicker air gap with thinner insulation to save space.
Customer testing shows a surface temperature reduction of 1–4 °C is achievable.
Technical expertise to manage 5G and radio frequency heating:
- High loading of aerogel to obtain low conductivity and low dielectric constant
- Consistent distribution of aerogel enables consistent conductivity
- Consistent thickness across a range of thicknesses from 100 – 530 μm
Thermal insulation surface touch temperature
Thermal insulation 5g mmWave antenna module
By Your Side From Design To Manufacture
Leading OEMs select Gore because our products and services help develop differentiated and innovative products — with low development risk and a stable supply chain — in a fast-paced, highly competitive market.
Global Mobile Suppliers
Decades as a preferred venting partner of global top OEMs in a wide range of applications — from smartphones and smart watches to tablets, earphones, Bluetooth speakers and cameras.
Supply Security
Years of experience in the challenging field of mobile electronics have made us experts at supplying high-volume, fast-ramp products with the timing and quality required for success.
Fast Response Designs
Gore supports the need of the mobile electronics industry with quick turnaround of designs and prototypes, to ensure that engineering teams can meet their project timelines.
Reliable Performance
Every Gore product must meet the highest standards of quality, performance and reliability. Through a deep understanding of end-use applications and demands, our products deliver what we promise.
The Effect Insulation Has on Heat Transfer
This video demonstrates the effect insulation has on heat transfer. Watch how rapidly heat melts a crayon with and without GORE® Thermal Insulation.
Assembling GORE Thermal Insulation for 5G Antennas
It’s easy to install GORE Thermal Insulation atop a 5G mmWave Antenna to maximize performance.
Technical Information
| Characteristic | ||||||
|---|---|---|---|---|---|---|
| Dielectric constanta | 1.46 | |||||
| Loss tangenta | 0.017 | |||||
| Typical signal loss with 350µm part | < 0.3 dB | |||||
| Insulation thickness availableb | 0.10 mm | 0.12 mm | 0.23 mm | 0.28 mm | 0.38 mm | 0.53 mm |
| Adhesive encapsulation width (minimum)c | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1.5 mm |
| Thermal conductivity (k)d | 0.021 W/m•K | 0.020 W/m•K | ||||
| Compression @ 100 kPa (14.5 psi) | 13% | 8% | ||||
| Specific heat capacitye | 1.8 J/g °C | |||||
| Bulk density | 0.37 g/cc | |||||
| Operating temperaturef | -40 °C to 100 °C | |||||
| Protective cover film | Black PET | |||||
| Adhesive type | Acrylic | |||||
| RoHSg | Meets threshold requirements | |||||
| Max part size | 100 mm × 200 mm | |||||
aNominal values representative of frequency range from 6 GHz to 70 GHz.
bNominal thickness based on reported values of thickness of each component of the stack-up.
cNominal minimum width.
dNominal conductivity value based on a modified version of ASTM C518.
eNominal heat capacity measured according to ASTM E2716 Method B at 75 °C.
fAlternate adhesives required to exceed 100 °C.
gTo the best of our knowledge, the product listed above does not have any restricted substances above the maximum concentration values listed in RoHS Directive 2011/65/EU and meets the substance restrictions of Article 4 of RoHS Recast including Commission Delegated Directive 2015/863.
*All values based on nominal characteristic and do not represent the specification and tolerance.
| Nominal thicknessa | 0.28 mm |
|---|---|
| Adhesive encapsulation width (minimum)b | 1 mm |
| Dimensions | Image  |
aNominal thickness based on reported values of thickness of each component of the stack-up.
bNominal minimum width.
**Could fit a Qualcomm® QTM545 module, product of Qualcomm Technologies Inc. and/or its subsidiaries.
With ultra-low thermal conductivity and dielectric constant, GORE Thermal Insulation prevents throttling of 5G data rates by reducing surface temperatures and minimizing 5G signal interference.
Case Studies
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FOR INDUSTRIAL USE ONLY
Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.
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