GORE® Thermal Insulation for Mobile Devices
GORE® Thermal Insulation is an advanced thermal management solution with a conductivity lower than air that enhances heat spreading.
Meet Growing Thermal Challenges in Mobile Devices
GORE Thermal Insulation increases design flexibility and the ability to direct heat through greater control of z-axis thermal conductivity. Improved z-axis control means superior spreading options that enable components to:
- perform at higher levels for longer periods
- accommodate shrinking form factors
- meet surface temperature requirements
Effective Thermal Management with Enhanced Thermal Spreading
Our insulating laminates for electronics have a through-plane thermal conductivity (kz) significantly lower than that of air. Enabled by premium aerogel technology, GORE Thermal Insulation will enhance the heat-spreading ratio and outperform system-level air gaps.
It can be used independently or in conjunction with heat spreaders to create a higher-performing thermal design.
Electrically Insulative
- Provides a physical barrier between device components
- Does not create electrical short circuits
- Has minimal interference with EM/RF interference
- Enables superior thermal conductivity of electrical insulator: outperforms all others tested*
Ease of Integration
- Can be combined with graphite or heat pipes to optimize performance
- Easy to install with six thickness options and ability to customize shape
- Conformable thermal and electrical insulator fits into tight, non-flat spaces
Development Support
- Gore engineers are available to support you with design guidance, modeling and integration from early design cycle through commercialization
* Data available upon request
GORE Thermal Insulation Can Be Used in All Kinds of Mobile Devices
Many powered components are generating more heat in smaller spaces. More heat generation requires advanced thermal solutions to spread heat more evenly across the device surface and reduce hot spots.
GORE Thermal Insulation for Mobile Devices offers superior heat spreading across devices such as:
- Tablets
- Wearables
- AR/VR Devices
- Smartphones
- Laptops
Improve Your Existing Solution with GORE Thermal Insulation
Incorporating this innovative heat spreading solution not only enhances the thermal management of your device, but also opens up new opportunities for your company to achieve peak performance and design excellence.
Increase Performance | Reduce Hotspot Temperature | Thinner Product Design |
|---|---|---|
•With a kz lower than air, thinner GORE Thermal Insulation can replace the air gap, allowing for more graphite to be included •Delay throttling of performance by moving heat away from the heat source and blocking heat from the device surface •Enable components to operate at higher power for longer time | •Reduce surface temperatures by 1– 6 °C (depending upon system power and insulation thickness) | •Enable thinner designs while maintaining performance by replacing an air gap with Gore's thinner, compressible thermal insulation |
By Your Side from Design to Manufacture
Leading OEMs select Gore because our products and services help develop differentiated and innovative products — with low development risk and a stable supply chain — in a fast-paced, highly competitive market.
Global Mobile Suppliers
Decades as a preferred venting partner of global top OEMs in a wide range of applications — from smartphones and smart watches to tablets, earphones, Bluetooth speakers and cameras.
Collaborative Approach
From testing and technical support to deep industry expertise, our teams work closely with customers to ensure exceptional performance and lasting value. We take the time to understand your operations, your processes, and your unique challenges to build partnerships rooted in trust and collaboration.
Supply Security
Years of experience in the challenging field of mobile electronics have made us experts at supplying high-volume, fast-ramp products with the timing and quality required for success.
Reliable Performance
Every Gore product must meet the highest standards of quality, performance and reliability. Through a deep understanding of end-use applications and demands, our products deliver what we promise.
The Effect Insulation Has on Heat Transfer
This video demonstrates the effect insulation has on heat transfer. Watch how rapidly heat melts a crayon with and without GORE® Thermal Insulation.
GORE Thermal Insulation x DELL XPS 13
DELL uses GORE Thermal Insulation to improve performance and slim the design of its laptops.
Technical Information
Material Data*
Characteristic |
|
|
|
|
|
|
|---|---|---|---|---|---|---|
Insulation thickness availablea | 0.10 mm | 0.12 mm | 0.23 mm | 0.28 mm | 0.38 mm | 0.53 mm |
Adhesive encapsulation width (minimum)b | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1.5 mm |
Thermal conductivity (k)c | 0.021 W/m•K |
| 0.020 W/m•K |
|
|
|
Compression @ 100 kPa (14.5 psi) | 13% |
| 8% |
|
|
|
Specific heat capacityd | 1.8 J/g °C |
|
|
|
|
|
Bulk density | 0.37 g/cc |
|
|
|
|
|
Operating temperaturee | -40°C to 100 °C |
|
|
|
|
|
Protective cover film | Black PET |
|
|
|
|
|
Adhesive type | Acrylic |
|
|
|
|
|
RoHSf | Meets threshold requirements |
|
|
|
|
|
Max part size | 100 mm x 200 mm |
|
|
|
|
|
a Nominal thickness based on reported values of thickness of each component of the stack-up.
b Nominal minimum width.
c Nominal conductivity value based on a modified version of ASTM C518.
d Nominal heat capacity measured according to ASTM E2716 Method B at 75 °C.
e Alternate adhesives required to exceed 100 °C.
f To the best of our knowledge, the product listed above does not have any restricted substances above the maximum concentration values listed in RoHS Directive 2011/65/EU and meets the substance restrictions of Article 4 of RoHS Recast including Commission Delegated Directive 2015/863.
*All values are based on nominal characteristics and do not represent the specification and tolerance.
Also known as “Anisotropic Ratio,” this ratio characterizes heat dissipation:
KxyKz | kxy - Thermal conductivity in-plane divided by kz - Thermal conductivity through-plane |
Common heat spreader materials have an intrinsically high anisotropic ratio, which promotes heat to spread and move in-plane.
However, compared to insulators, these materials have a very high Kz , which allows heat to move through-plane and reach device surfaces. To compensate for spreaders' high Kz , thermal engineers often design air gaps (with low Kz) above spreaders.
Comparison: Effectiveness of Thermal Spreading with and without GORE Thermal Insulation
GORE Thermal Insulation increases the designer’s ability to direct heat by enabling greater control of z-axis thermal conductivity. More control means superior spreading options and more design flexibility.
Combining GORE Thermal Insulation with graphite for example — one of many possible configurations — allows for more graphite to be included, as a thinner amount of insulation can be used to provide the same thermal resistance as a thicker air gap.
Added graphite capacity in the system allows for components to be utilized at higher power outputs, as the additional generated heat can be directed away from the component.
Basic Spreading
Graphite & Air
Side View - Thermal Solution
Top View - Hotspot
Enhanced Spreading
Graphite & GORE® Thermal Insulation (GTI)
Side View - Thermal Solution
Top View - Hotspot
Heat spreading effectiveness of a basic thermal design using graphite and air (left) compared to a thermal design using graphite and GORE Thermal Insulation (right). The basic thermal design fails to reduce hot spots because, while the heat is conducted through graphite in the xy-direction, it is also conducted in the z-direction of graphite, resulting in a hot spot.
Using GORE Thermal Insulation instead of an air gap reduces z-axis conductivity, increases the spreading ratio and reduces hot spots.
GORE Thermal Insulation contains aerogel particles suspended in a PTFE matrix to deliver conductivity lower than that of air. This thermal insulation material for electronics can be used to reduce hot spots by replacing air gaps. It can also be paired with graphite to enhance thermal spreading in-plane without increasing thermal transfer through-plane.
GORE Thermal Insulation is a compressible thermal insulation. With compression levels up to 13% under a 100 kPa load, it can be used for tolerance take-up or to assist with impact resistance. It also has the ability to adhere to curved or stepped surfaces without negatively affecting performance.
GORE Thermal Insulation is a thermal and electrical insulator. With thermal conductivity lower than that of air, this insulation is also an effective electrical insulator, with a volume resistivity > 10^15 ohm-cm.
The typical thermal conductivity of electrical insulators is low, in the range of 0.05 – 0.8 W/m-K 0.03-0.8 W/m·K. However,
GORE Thermal Insulation is far better, with conductivity as low as 0.020 W/m·K, while also delivering good electrical insulation.
Technology Expertise in Thermal Management for Mobile Devices
- High loading of aerogel to obtain low conductivity
- Consistent distribution of aerogel enables consistent conductivity
Consistent thickness across a range of thicknesses from 100-530 μm
All data points are from finished good parts of Gore and competitor (insulation + adhesives + cover films)
Gore Thermal Insulation cross section
- Pull Tab
- Protective Film
- GORE® Thermal Insulation
- Base Adhesive
- Base Liner
Gore Thermal Insulation surface images
Featured Content
Explore More
FOR INDUSTRIAL USE ONLY
Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.
Prefer to Call?
Have questions or unique requirements?
Our experts are here to guide you.