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Unmatched Cleanliness, Durability and Performance

GORE® Ultraclean Static Round Cables and Assemblies offer greater precision and cleanliness for more extreme miniaturization and greater reliability for higher yield, quality and speed. They achieve higher data rates with better signal integrity over longer distances, along with precise, reliable terminations in high-purity lithography processing and high-vacuum applications.

Features & Benefits
Applications

Custom-Engineered for High-Vacuum Environments

Designed for static applications, GORE Ultraclean Static Round Cables and Assemblies meet the most extreme requirements for high vacuum environments, offering features that include:

  • low-particulation, low-contamination, low-outgassing materials
  • chemically inert and temperature-resistant materials
  • very flexible round cable construction

Our finished cables and assemblies provide equipment manufacturers with a host of benefits unmatched by other lithography cables, like:

  • meet EUV Cleanliness Grade 1 specifications for high purity
  • greater precision and cleanliness to support more extreme miniaturization
  • deliver higher data rates with better signal integrity over longer distances
  • tight, flexible bend radius for easy installation and precise, reliable terminations
  • greater reliability to support demands for higher yield and productivity
  • less maintenance, downtime and total cost and more EUV machine uptime
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Cleaning process ultraclean cable

Meeting the Growing Demands of Fabs Using EUV Lithography Processes

Advanced EUV (extreme ultraviolet) lithography systems conduct multiple sophisticated handling, exposure and imaging functions, all within a high-vacuum environment that provides the high purity in semiconductors that today’s standards require.

At the heart of these systems is where you’ll find GORE Ultraclean Static Round Cables and Assemblies for Projection Optics Box (POB) and Illuminator, where optical assembly takes place. 

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High flex cables and assemblies for lithography

Light is transmitted from reticle to wafer using a complex series of mirrors that reduce the reticle mask pattern to the size of the chip.

Gore Technologies Offer Improvements throughout Semiconductor Manufacturing Processes
Gore Technologies Offer Improvements Throughout Semiconductor Manufacturing Processes

See where our broad capabilities and solutions are used in many critical processes — from lithography, wafer cleaning, and metrology & inspection to advanced packaging, SoC testing and more.

Technical Information

These values demonstrate the mechanical and environmental performance of GORE Ultraclean Static Round Cables for lithography.

Mech./Environ. PropertyValue
Jacket MaterialPTFE & Fluoropolymer
Jacket ColorWhite & Opaque
Core TypesSignal & Power
Minimum Bend Radius> 10 x OD
Temperature Rangea °C-20 to +260
Cleanliness Class (ISO14664-1)1
Outgassing mBar liter/sec cm2 

H20 (AMUb 18)

6.00E-10

CxHyv (volatile CxHy) (AMUb 45-100)

2.00E-12

CxHynv (non-volatile CxHy) (AMUb 101-200)

5.00E-13
Hydrogen-Induced Outgassing (HIO)Applicable
Forbidden MaterialsApplicable
Particle-FreeApplicable
CertificationsUL

a. Dependent on specific application requirements.
b. AMU = Atomic Mass Units.

Featured Content

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Improving Cable Performance in Harsh Environments

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Gore Semiconductor Capabilities Overview

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FOR INDUSTRIAL USE ONLY 

Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.

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+1 800 294 4673 
+1 410 506 1715