GORE® Ozonation Modules for Semiconductor & Microelectronics Processing
Gore's modules generate the cleanest, bubble-free, highest concentration ozone water for cleaning silicon wafers and semiconductor and FPD fabrication processing.
The Cleanest, Bubble-Free Ozone Water Solution
GORE® Ozonation Modules are successfully used in an ozone water-based wafer cleaning tool for silicon wafer and semiconductor applications. They provide a safer and more effective treatment using deionized ozone water (DI-O3 water) than commonly used methods involving harsh chemicals and many semiconductor cleaning process steps.
Benefits to Semiconductor Cleaning Equipment Manufacturers of using GORE Ozonation Modules:
- Bubble-free, ultra-high purity ozone water at highest concentration up to 200 mg/L
- Cleanest ozone water due to unique fluoropolymer construction
- No particle contamination due to ePTFE membrane tube
- High WEP > 0.40 MPa due to microporous membrane technology
- Proven continuous and consistent operation
- Easy-to-control ozone water flow rate and concentration
GORE Ozonation Modules are a cost-effective solution for use in leading-edge SEMI process ozone water applications and cleaning processes with ozone in the microelectronics industry, like:
- Silicon wafer cleaning and production
- Logic and memory fabrication
- LED/OLED/QOLED (LTPS) flat panel display cleaning & production
- Photomask
GORE Ozonation Modules Compared to Other Ozone-Dissolving Technologies
GORE Ozonation Modules continuously and consistently dissolve ozone gas into ultra-high pure water to generate the cleanest, bubble-free ozone water – cleaner than ozone water generated by mechanical mixer technology, like an ejector or static mixer.
The dissolving ozone-in-water mechanism in GORE Ozonation Modules is diffusion based on the difference in total gas pressure, which generates the cleanest bubble-free ozone water.
| Critical Attributes | GORE Ozonation Modules | Mechanical Mixers (injector/ejector & static mixer) |
|---|---|---|
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Gore Technologies in Semiconductor Manufacturing Processes
With decades of unique materials science technology and in-depth application knowledge, Gore offers proven solutions that ensure cleanliness, durability and reliability.
GORE Ozonation Modules for Semiconductor & Microelectronics Fabrication Processing
Ozone-dissolving modules from Gore are the proven, reliable solution for improved semiconductor and microelectronics cleaning process performance and yield.
Technical Information
These values demonstrate the characteristics of GORE Ozonation Modules for semiconductor and microelectronics processing.
| Property | Gore Part Number | |
|---|---|---|
| GN-142-300 | GN-142-650 | |
| Length (Flange-to-Flange) mm | 300 | 650 |
| Diameter mm | 142 | 142 |
| Membrane Material | Expanded PTFE | Expanded PTFE |
| Housing Material | PTFE/PFA | PTFE/PFA |
| Ozone Concentration ppm | Up to 200 | Up to 200 |
| Water Entry Pressure (WEP) MPa | > 0.40 | > 0.40 |
| Maximum Liquid Pressure MPaG | 0 to 0.35 | 0 to 0.35 |
| Maximum Gas Pressure MPaG | 0.25 | 0.25 |
| Recommended Operating Temperature °C | 0 to +30 | 0 to +30 |
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FOR INDUSTRIAL USE ONLY
Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.
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