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Driving Innovation in Front-End Wafer Processing and Back-End Assembly and Testing

Gore continually explores new technologies, solutions and partnerships with like-minded manufacturers to push the boundaries of advancement.

The semiconductor industry continues to demand smaller microchips with more processing power and memory, higher purity fab processes, increased wafer output and improved yields — all while reducing production costs.

Advanced solutions from Gore enhance semiconductor manufacturing with chemically inert PTFE-based materials that withstand the harshest cleanroom conditions. From front-end wafer production to back-end assembly and testing, our cables, assemblies, membranes and modules ensure clean, reliable and repeatable processes.

Gore Technologies Offer Improvements throughout Semiconductor Manufacturing Processes
Product Solutions
Focus Areas

Our Advanced Cleanroom Technologies 

Gore’s variety of high-performance solutions solve the complex semiconductor equipment and processing issues that companies face today and in the future. 

Discover More Solutions for Semiconductor Manufacturing & Fabrication

Semiconductor Production Equipment

With proven precision and reliability, Gore’s flat and trackless cables are certified for ISO Class 1 cleanroom, low-pressure vacuum and sensitive ESD (electrostatic discharge) environments. They offer faster transmission speeds over millions of flex cycles, reduce particulation and outgassing and eliminate cable carriers.

Elevating Semiconductor Production Throughput & Yield

Lithography, Metrology & Inspection Equipment

Custom-engineered Gore ultraclean solutions for static and flexible applications offer more precision at faster speeds for higher yields. They’re qualified for Cleanliness Grade 1 high-vacuum environments and Cleanliness Grades 2 and 4 EUV and UV lithography applications. They can also help manufacturers prepare for emerging high-NA EUV systems.

Discover Gore Cables in Semiconductor Lithography, Metrology and Inspection Equipment

Semiconductor & Microelectronics Processing

Gore’s microfiltration membranes assure process purity, helping manufacturers provide customers with the best filters to increase fab process yields. While our ozonation modules generate the cleanest bubble-free ozone water to help reduce harsh chemical use in silicon wafer cleaning and semiconductor and FPD fab processing.

GORE® Ozonation Modules_short version

Semiconductor & Chip Test Equipment

Rugged and flexible, Gore’s microwave/RF test assemblies deliver accurate, repeatable measurements to improve test outcomes in wafer test systems, package testing, system-on-chip (SoC) automated test equipment and mmWave 5G test systems.

GORE® Microwave/RF Test Assemblies Showcase

High-Precision Lithography Solutions for Semiconductor Manufacturing Excellence

Gore empowers next-gen semiconductor manufacturing with advanced lithography solutions for precision, efficiency and scalability.

Semicon Climate Consortium

We are part of SCC, collaborating with industry peers to shape industry standards and set collective goals that reflect our shared commitment to sustainability.

Featured Content

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Cable Particulation Study for Cleanroom Environments

Germany’s Fraunhofer Institute tested and measured Gore’s flat and trackless cables and found they maintained the lowest particulation levels for repeated flexing in cleanroom environments.
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Gore Semiconductor Capabilities Overview

See where our broad capabilities and solutions are used in many critical processes — from lithography, wafer cleaning, and metrology & inspection to advanced packaging, SoC testing and more.

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