Exceptional EMI protection with easy SMT integration
In automotive electronic devices, grounding and shielding products must ensure electrical performance without breaking
under severe mechanical and environmental stress throughout the vehicle service life. However, metal spring contacts and clips
typically create single point contact that can fatigue over time and decrease electrical performance after exposure to conditions such as vibration, shock, extreme temperatures and other challenging road conditions. In addition, metal contacts can scratch mating surfaces damaging the device enclosure and generating conductive particles. All of these issues can compromise device performance leading to failure and warranty issues.
GORE® SMT EMI Gaskets and Grounding Pads, Supersoft Series delivers excellent electrical performance by providing reliable
grounding and shielding in challenging automotive conditions. These components ensure consistent grounding through a large
conformable contact area for low DC resistance throughout the vehicle service life. In addition, the patented construction of the
Supersoft Series reduces the likelihood of enclosure surface abrasion and particulation (Table 1 and Figure 1).
Increased Design Flexibility and Easy Integration
The Supersoft Series offers a convenient design compatible with surface mount technology (SMT) that can be easily integrated into
existing production lines. These off-the-shelf components eliminate the need for custom designs and secondary processing.
This translates to increased flexibility in your designs, easy installation, faster production rates and lower total costs over time.
Proven Track Record
For more than 10 years, GORE® SMT EMI Gaskets and Grounding Pads, Supersoft Series has delivered reliable performance in many automotive electronics. The Supersoft Series can be reliably used in typical applications such as:
- Advanced driver assistance systems (ADAS)
- Cameras and radar systems
- Connectivity devices
- Infotainment systems
- Instrument cluster control modules
- Navigation systems
- Powertrain electronics
- Telematics control units (TCU)
- Large conformable contact area for low DC resistance throughout vehicle ser vice life due to patented construction
- Reduced electromagnetic interference (EMI) and crosstalk in challenging environments
- Reduced likelihood of enclosure surface abrasion and particulation
- Increased design flexibility and reduced total costs with easily integrated standard parts versus custom designs
- Faster production rates because of consistent and repeatable assembly with SMT-compatible parts
Table 1: Product Information
|Operating Temperature||-55°C to +150°C|
|Gasket Material||Silver nickel-filled silicone over silicone core|
|Shim Material||Silver-plated copper alloy|
|Gasket Color||Orange core with tan cover|
|Recommended Installation||Parallel to radiating elements|
* W. L. Gore & Associates declares that we do not intentionally add substances listed in EU Directive 2011/65/EU to GORE® SMT EMI Gaskets and Grounding Pads. Independent lab tests have been performed, and results are available upon request.
Figure 1: Patented Construction of Supersoft Series
The Supersoft Series of GORE® SMT EMI Gaskets and Grounding Pads have been extensively tested according to the following
performance standards. Please contact your Gore representative for more detailed information.
Figure 2: Environmental Performance Testing of Supersoft Series
Commercial Sprung Mass Vibration
Performance after vibration at various temperatures
|Test Conditions||32 hr/ plane
3 primary planes
Tmin: -40 °C
Tmax: +150 °C
Performance after exposure to mechanical shocks
|Test Conditions||Half sine pulse shape
500 m/s2 acceleration
6 ms duration
6 primary directions
High Temperature Steady State
Performance after exposure to high temperature conditions
|Test Conditions||+150 °C
2000 hr duration
Thermal Shock with Specified Transition Time
Performance after exposure to changing temperature conditions
|Test Conditions||Tmin: -40 °C
Tmax: +150 °C
< 30 s temperature change
30 min dwell time
Damp Heat, Steady State
Performance after exposure to hot, humid environments
|Test Conditions||+85 °C
85% relative humidity
504 hr duration
Table 2: Supersoft Series Typical Performance 1
|Gore Part Number||25SMT-4442-01 REV A||25SMT-4442-03 REV A|
|Compressed Part Height (mm)||1.48||2.20|
|DC Resistance (ohms)||0.008||0.012|
|Force to Achieve Compression (N)||0.9||1.8|
|Compressed Part Height (mm)||1.19||1.90|
|DC Resistance (ohms)||0.006||0.011|
|Force to Achieve Compression (N)||2.3||3.6|
|Compressed Part Height (mm)||0.90||1.60|
|DC Resistance (ohms)||0.009||0.011|
|Force to Achieve Compression (N)||7.0||6.2|
1 Values are for reference only and are not intended for specification purposes.
Table 4: Recoverability of Supersoft Series
|Gore Part Number||Test Method||After 22 Hours of Compression||After 70 Hours of Compression|
|25SMT-4442-01 REV A||ASTM D395 Test Method B||96%||96%|
|25SMT-4442-03 REV A||97%||97%|
The Supersoft Series is engineered to survive multiple reflow processes and maintain conductivity in a wide range of compressed part heights (gap distances). Specific application requirements depend upon the following criteria:
- Gap distance between the Printed Circuit Board (PCB) and the mating surface (Figure 5)
- Compression force between the mating surface and Gore’s part
- Required DC resistance and/or shielding effectiveness to achieve electromagnetic compatibility (EMC) (Table 2).
Low DC Resistance with Minimal Force
Gore performed testing on soldered and reflowed parts. Results showed that the Supersoft Series is conductive on contact and resilient after compression. The amount of force and DC resistance differs for each part number as shown in Table 2, and Figures 3 and 4.
The combination of a large conformable contact area and minimal force requirements make the Supersoft Series an excellent choice for a variety of applications such as enclosure grounding, board-to-board grounding and EMI shielding.
Figure 3: Force Displacement Resistance After Reflow for 25SMT-4442-01 REV A
Figure 4: Force Displacement Resistance After Reflow for 25SMT-4442-03 REV A
Figure 5: Recommended Compressed Part Heights for Supersoft Series
GORE SMT EMI Gaskets and Grounding Pads, Supersoft Series for automotive electronics is available in standard sizes. Visit our website at gore.com/autoemi
for more technical information, including a design guide. To discuss your specific application needs or request a quote, contact a Gore sales representative.
GORE® SMT EMI Gaskets and Grounding Pads, Supersoft Series for automotive electronics is covered by patent No. US 6,255,581 B1 and US 7,129,421 B2. Corresponding foreign patents issued.
NOTICE — USE RESTRICTIONS APPLY Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.
All technical information and recommendations given here is based on Gore's previous experiences and/or test results. Gore gives this information to the best of its knowledge, but assumes no legal responsibility. Customers should check the suitability and usability in the specific application, since the performance of the product can only be judged when all necessary operating data are available. The above information is subject to change and is not to be used for specification purposes. Gore's terms and conditions of sale apply to the sale of the products by Gore.