Reduce 5G Antenna Hot Spots with a Thermal Insulator that’s Better than Air
The Effect Insulation Has on Heat Transfer
Shown above is how crayons – with and without GORE Thermal Insulation – melt at different rates.

Today’s sophisticated 5G mmWave antenna modules incorporate power amplifiers that generate heat close to the edge of the device. It is difficult to reduce these hotspots as traditional thermal management techniques such as graphite spreaders cannot be used due to their high RF interference. With many components in such a small space, there is limited space available to utilize large air gaps to prevent surface hot spots.

The large heat load combined with limited thermal management options leads to most 5G mmWave signals being throttled within a minute of use. GORE Thermal Insulation for 5G mmWave antennas is designed to fit on top of 5G mmWave antenna modules to prevent surface hot spots with minimal RF interference.

They are available in 5 different thicknesses which can be provided in custom shapes or designed to fit the most commonly used Qualcomm® modules*. These parts feature insulation that blocks heat better than air and has extremely low RF signal transmission loss. GORE Thermal Insulation for 5G mmWave antennas helps maintain 5G signal duration by reducing surface temperatures for a superior user experience.

*Qualcomm is a trademark or registered trademark of Qualcomm Incorporated.

Why use GORE Thermal Insulation to Maximize 5G mmWave Antenna Performance?
  • An icon with arrows coming from a smartphone indicates that 5G antennas emit heat. But GORE® Thermal Insulation reduces hot spots significantly.

    • Thermal conductivity at 0.020 W/mK reduces heat flow by 23% compared to an air gap at 25 °C (0.026 W/mK)
    • Heat can be redirected to the back side of the module where graphite can be used to spread heat without interrupting the 5G signal

  • An icon with a smartphone and the writing 5G on it indicates that GORE® Thermal Insulation maintains the integrity of the 5G mmWave signal.

    • Longer duration of 5G mmWave signal before needing to throttle
    • Minimal signal loss across mmWave frequencies ensured by low dielectric constant

  • An icon showing an electrically insulative barrier to indicate that the antenna module is prevented from touching the case of the device when there are small air gaps.

    • Electrically insulative barrier prevents the antenna module from touching the case when there are small air gaps

  • An icon with an arrow pointing to the inside of a smartphone indicates that GORE® Thermal Insulation is easy to fit and install.

    • Available in 5 different thicknesses which can be provided in custom shapes or designed to fit the most commonly used Qualcomm® modules
    • Replace a thicker air gap with a thinner insulation to save space


Closer Look at GORE Thermal Insulation for 5G mmWave Antennas
Thermal image of two smartphones: The bottom one with, the top one without GORE® Thermal Insulation. The one with GORE® Thermal Insulation stays significantly cooler.

GORE Thermal Insulation significantly reduces smartphone 5G mmWave antenna hot spots. Customer testing shows a surface temperature reduction of 1 – 4 °C is achievable.

Technology Expertise

  • High loading of aerogel to obtain low conductivity
  • Consistent distribution of aerogel enables consistent conductivity
  • Consistent thickness across a range of thicknesses from 120 – 530 μm





Application Example

GORE Thermal Insulation Product Information

Material Data*
Dielectric constanta 1.43
Loss tangenta 0.017
Typical signal loss with 350µm part < 0.3dB
Insulation thickness availableb 0.12 mm 0.23 mm 0.28 mm 0.38 mm 0.53 mm
Adhesive encapsulation width (minimum)c 1 mm 1 mm 1 mm 1 mm 1.5 mm
Thermal conductivity (k)d 0.021 W/m•K 0.020 W/m•K
Compression @ 100 kPa (14.5 psi) 13% 8%
Specific heat capacitye 1.8 J/g °C
Bulk density 0.37 g/cc
Operating temperaturef -40 °C to 100 °C
Protective cover film Black PET
Adhesive type Acrylic
RoHSg Meets threshold requirements
Max part size 100 mm × 200 mm


aNominal values representative of frequency range from 6 GHz to 70 GHz.
bNominal thickness based on reported values of thickness of each component of the stack up.
cNominal minimum width.
dNominal conductivity value based on a modified version of ASTM C518.
eNominal heat capacity measured according to ASTM E2716 Method B at 75 °C.
fAlternate adhesives required to exceed 100 °C.
gTo the best of our knowledge, the part numbers listed above do not have any restricted substances above the maximum concentration values listed in RoHS Directive 2011/65/EU and meets the substance restrictions of Article 4 of RoHS Recast including Commission Delegated Directive 2015/863.

*All values based on nominal characteristic and do not represent the specification and tolerance

Reference design for 5G mmWave antenna part**
Nominal thicknessa 0.28 mm
Adhesive encapsulation width (minimum)b 1 mm
Dimensions Technical drawing of the dimensions of a reference design for 5G mmWave antenna part**.



aNominal thickness based on reported values of thickness of each component of the stack up.
bNominal minimum width.
**Could fit a Qualcomm QTM545 module, product of Qualcomm Technologies Inc. and/or its subsidiaries.

GORE Thermal Insulation Cross Section
A cross section of a thermal design consisting of a base liner, a base adhesive, GORE® Thermal Insulation, a protective film and a pull tab.

With ultra-low thermal conductivity and dielectric constant, GORE Thermal Insulation prevents throttling of 5G data rates by reducing surface temperatures and minimizing 5G signal interference.

Working with Gore

By Your Side from Design to Manufacture

Leading OEMs select Gore because our products and services help develop differentiated and innovative products with low development and supply chain risk in a fast-paced, highly competitive market.

  • Smartphone icon indicating that Gore is a preferred venting partner of global OEMs for various applications from smartphones to cameras.

    Decades as a preferred venting partner of global top OEMs in a wide range of applications – from smartphones and smartwatches over tablets, earphones, and Bluetooth speakers to cameras.

  • Hourglass icon indicating Gore’s ability to support the industry’s need for quickness.

    Gore supports the need of the mobile electronics industry for quickness with designs and prototypes to ensure that engineering teams can meet their project timelines.

  • Pin location icon indicating Gore’s experience and reliability in supply security.

    Years of experience in the challenging field of mobile electronics have made us experts at supplying high volume, fast ramp products with the timing and quality required for success.

  • Checkmark icon indicating Gore’s dedication to meet the highest standards of quality, performance and reliability

    Every Gore product must meet the highest standards of quality, performance and reliability. Through a deep understanding of end-use applications and demands, our products deliver what we promise.



Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.

Resource Library

Get all the media and documentation available for GORE Thermal Insulation: