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Reduce 5G Antenna Hot Spots with a Thermal Insulator that’s Better than Air
Today’s sophisticated 5G mmWave antenna modules incorporate power amplifiers that generate heat close to the edge of the device. It is difficult to reduce these hotspots as traditional thermal management techniques such as graphite spreaders cannot be used due to their high RF interference. With many components in such a small space, there is limited space available to utilize large air gaps to prevent surface hot spots.
The large heat load combined with limited thermal management options leads to most 5G mmWave signals being throttled within a minute of use. GORE Thermal Insulation for 5G mmWave antennas is designed to fit on top of 5G mmWave antenna modules to prevent surface hot spots with minimal RF interference.
They are available in 5 different thicknesses which can be provided in custom shapes or designed to fit the most commonly used Qualcomm® modules*. These parts feature insulation that blocks heat better than air and has extremely low RF signal transmission loss. GORE Thermal Insulation for 5G mmWave antennas helps maintain 5G signal duration by reducing surface temperatures for a superior user experience.
*Qualcomm is a trademark or registered trademark of Qualcomm Incorporated.
Why use GORE Thermal Insulation to Maximize 5G mmWave Antenna Performance?
• Thermal conductivity at 0.020 W/mK reduces heat flow by 23% compared to an air gap at 25 °C (0.026 W/mK)
• Heat can be redirected to the back side of the module where graphite can be used to spread heat without interrupting the 5G signal
MAINTAIN INTEGRITY OF SIGNAL
• Longer duration of 5G mmWave signal before needing to throttle
• Minimal signal loss across mmWave frequencies ensured by low dielectric constant
FEWER DROPPED SIGNALS
• Electrically insulative barrier prevents the antenna module from touching the case when there are small air gaps
EASY TO FIT AND INSTALL
• Available in 5 different thicknesses which can be provided in custom shapes or designed to fit the most commonly used Qualcomm® modules
• Replace a thicker air gap with a thinner insulation to save space
Closer Look at GORE Thermal Insulation for 5G mmWave Antennas
GORE Thermal Insulation significantly reduces smartphone 5G mmWave antenna hot spots. Customer testing shows a surface temperature reduction of 1 – 4 °C is achievable.
- High loading of aerogel to obtain low conductivity
- Consistent distribution of aerogel enables consistent conductivity
- Consistent thickness across a range of thicknesses from 120 – 530 μm
In a case study representing this 5G module antenna application with 1W of power, GORE Thermal insulation with 350µm insulation thickness was installed in a 500µm air gap and reduced surface temperature by 4°C compared to air after 20 minutes of run time.
GORE Thermal Insulation Product Information
|Typical signal loss with 350µm part||< 0.3dB|
|Insulation thickness availableb||0.12 mm||0.23 mm||0.28 mm||0.38 mm||0.53 mm|
|Adhesive encapsulation width (minimum)c||1 mm||1 mm||1 mm||1 mm||1.5 mm|
|Thermal conductivity (k)d||0.021 W/m•K||0.020 W/m•K|
|Compression @ 100 kPa (14.5 psi)||13%||8%|
|Specific heat capacitye||1.8 J/g °C|
|Bulk density||0.37 g/cc|
|Operating temperaturef||-40 °C to 100 °C|
|Protective cover film||Black PET|
|RoHSg||Meets threshold requirements|
|Max part size||100 mm × 200 mm|
aNominal values representative of frequency range from 6 GHz to 70 GHz.
bNominal thickness based on reported values of thickness of each component of the stack up.
cNominal minimum width.
dNominal conductivity value based on a modified version of ASTM C518.
eNominal heat capacity measured according to ASTM E2716 Method B at 75 °C.
fAlternate adhesives required to exceed 100 °C.
gTo the best of our knowledge, the part numbers listed above do not have any restricted substances above the maximum concentration values listed in RoHS Directive 2011/65/EU and meets the substance restrictions of Article 4 of RoHS Recast including Commission Delegated Directive 2015/863.
*All values based on nominal characteristic and do not represent the specification and tolerance
Reference design for 5G mmWave antenna part**
|Nominal thicknessa||0.28 mm|
|Adhesive encapsulation width (minimum)b||1 mm|
aNominal thickness based on reported values of thickness of each component of the stack up.
bNominal minimum width.
**Could fit a Qualcomm QTM545 module, product of Qualcomm Technologies Inc. and/or its subsidiaries.
GORE Thermal Insulation Cross Section
Working with Gore
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Leading OEMs select Gore because our products and services help develop differentiated and innovative products with low development and supply chain risk in a fast-paced, highly competitive market.
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FAST RESPONSE DESIGNS
Gore supports the need of the mobile electronics industry for quickness with designs and prototypes to ensure that engineering teams can meet their project timelines.
Years of experience in the challenging field of mobile electronics have made us experts at supplying high volume, fast ramp products with the timing and quality required for success.
Every Gore product must meet the highest standards of quality, performance and reliability. Through a deep understanding of end-use applications and demands, our products deliver what we promise.
FOR INDUSTRIAL USE ONLY
Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.
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