Thermal Insulation for Mobile Devices

GORE Thermal Insulation has a thermal conductivity lower than air making it a powerful option in the thermal toolbox that can improve the consumer's experience through surface temperature hot spot reduction.

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Overview

The effect insulation has on heat transfer
Shown above is how rapidly heat melts a crayon without GORE Thermal Insulation.

Introducing the Best Thermal Insulator for Mobile Devices

Integrating higher power, higher temperature components into ever shrinking product form factors has created a thermal challenge in mobile electronics. Gore has developed GORE Thermal Insulation, a thin, flexible, and highly effective thermal insulation to help mobile device designers address this thermal challenge.

GORE Thermal Insulation has significantly lower thermal conductivity than air when it comes to reducing hot spots and lowering surface temperatures. So, more time can be spent at optimal performance levels before having to throttle due to thermal constraints.

Why use GORE Thermal Insulation instead of air?

  • SUPERIOR THERMAL CONDUCTIVITY.png

    SUPERIOR THERMAL CONDUCTIVITY
    at 0.020 W/mK, 23% lower than that of air gap at 25°C (0.026 W/mK)

  • HIGHER DEVICE PERFORMANCE.png

    HIGHER DEVICE PERFORMANCE
    by delaying need to throttle to minimize heat generation

  • THINNER PRODUCT DESIGNS.png

    THINNER PRODUCT DESIGNS
    by replacing an air gap of a specific size with thinner insulation while maintaining performance

  • REDUCED SURFACE TEMPERATURES.png

    REDUCED SURFACE TEMPERATURES
    of 1-7°C based on power and insulation thickness

  • MORE STABLE THERMAL CONDUCTIVITY.png

    MORE STABLE THERMAL CONDUCTIVITY
    compared to air when temperature changes

  • EASY INTEGRATION_0.png

    EASY INTEGRATION
    with graphite or heat pipe solutions to optimize performance

  • ELECTRICALLY INSULATED MATERIAL.png

    ELECTRICALLY INSULATED MATERIAL
    provides a physical barrier to avoid electrical short circuits or EMI/RF problems

Usage Scenarios

Thermal Insulation usage scenarios Chart

GORE Thermal Insulation usage scenarios

Scenario 1. Optimal performance

For designs within thermal limits, components can operate longer at ideal performance rates before needing to throttle to maintain surface temperatures.

Scenario 2. Decreased device thickness

This is achieved by shrinking the gap between the SoC and enclosure. If hot spots are present, it will redirect heat flow and reduce surface temperature.

Scenario 3. Decreased surface temperatures

Ideal for SoCs where surface temperatures often go above limits. With thermal conductivity of 0.020 W/mK, it’s superior to air (0.026 W/mK @ 25° C) as an insulator.

Application Example: Smartphone and Laptop

Product Information

Characteristic
Thermal conductivity (k)a 0.020 W/m•K
Specific heat capacityb 1.8 J/g °C
Bulk density 0.37 g/cc
Compression @ 100 kPa (14.5 psi) 6%
Operating temperaturec -40°C to 100 °C
Protective cover film Black PET
Adhesive type Acrylic
RoHSd Meets threshold requirements
Insulation thickness availablee 0.12 mm 0.28 mm 0.38 mm 0.54 mm
Adhesive encapsulation width (minimum)f 1 mm 1 mm 1 mm 1.5 mm
Max part size 100 mm x 200 mm

a nominal conductivity value based on a modified version of ASTM C518.
b nominal heat capacity measured according to ASTM E2716 Method B at 75 °C.
c alternate adhesives required to exceed 100 °C.
d to the best of our knowledge, the part numbers listed above do not have any restricted substances above the maximum concentration values listed in RoHS Directive 2011/65/EU and meets the substance restrictions of Article 4 of RoHS Recast including Commission Delegated Directive 2015/863.
e nominal thickness based on reported values of thickness of each component of the stack up.
f nominal minimum width.
*All values based on nominal characteristic and do not represent the specification and tolerance.

 

Resource Library

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