GORE® Low Charging Trackless Cables
Gore's next-generation cables prevent electrostatic buildup and reduce particle attraction for increased reliability and higher throughput in high flex cleanroom applications. An industry first, our cables can be used in an ESD-sensitive environment without additional equipment or complex grounding system.
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Resource Library
Portfolio: GORE® High Flex Cables for Semiconductor Applications
Data Sheets, 1.35 MB
As chips become smaller and more powerful, higher levels of process cleanliness and data rates continue to increase in semiconductor and FPD equipment. W. L. Gore & Associates offers proven solutions with more durability, flexibility and reliability that solve these complex issues to increase throughput and yield, reduce maintenance and total costs, and be ready for the future.
English (U.S.)
All Resources For GORE® Low Charging Trackless Cables
- Data Sheets (3)
- Authorized Distributors (1)
Overview
Evolving design/production technologies in flat panel displays and semiconductor equipment have made it possible for the industry to move toward higher density designs. But, these higher density designs have also made flat panel displays and integrate circuits (ICs) more susceptible to damage from electrostatic buildup. And, the electrostatic voltage that builds up over time has shown to attract particles on the outer surface of a moving cleanroom cable system, which can cause uncontrolled particulation.
All of these effects can be substantial, leading to reduced yield, increased maintenance cycles and higher overall costs.
INCREASED RELIABILITY AND HIGHER THROUGHPUT
GORE Low Charging Trackless Cables help prevent triboelectric charge and voltage buildup for better protection against ESD events. This next-generation cable system is built with a new non-carbon based material that reduces particle attraction to stop surface charge buildup and uncontrolled particulation.
Our unique cable technology is the first of its kind in the industry and can be used in an ESD-sensitive environment without any additional effort to install it. Our low-charging trackless cables don’t require a complex grounding system or extra equipment to perform either. They also eliminate the need for ionizers that are costly to calibrate and maintain. As a bonus, they can be easily retrofitted into our standard trackless high flex cables.
Ultimately, GORE Low Charging Trackless Cables reduce particle attraction and stop electrostatic buildup, significantly reducing the potential of ESD-related failures for increased reliability and higher throughput in your machine.
Applications
GORE Low Charging Trackless Cables are engineered to perform reliably in a variety of automation applications requiring high levels of cleanliness, including:
High Flex Machinery for Semiconductor
- Electronic Packaging Equipment
- Highly-Sensitive ESD Equipment
- Manufacturing / Inspection Processes
- Pick and Place Mounter Equipment
- Thermocompression Bonding Equipment
High Flex Machinery for Flat Panel Displays
- Highly-Sensitive ESD Equipment
- Lens Manufacturing
- Manufacturing / Inspection Processes
If you have any questions or to discuss your specific application needs, please contact a Gore representative.
Benefits
GORE Low Charging Trackless Cables provide manufacturers with many benefits that improve electrical and mechanical performance such as:
- prevent electrostatic buildup due to non-carbon based, dissipative materials
- eliminate particle attraction to reduce the risk of product damage
- reduce noise interference for improved signal integrity and higher throughput
- low-particulating material set certified to ISO Class 1 up to 1 Mio flex cycle
- first in the industry to be used in an ESD-sensitive environment as a stand-alone system that meets ISO Class 1
- easy retrofit due to 100% compatibility with standard GORE® Trackless High Flex Cables
- no complex grounding system or additional equipment needed
For more information about the benefits of our cables, please contact a Gore representative.
Properties
These values demonstrate the electrical, mechanical and environmental performance of GORE Low Charging Trackless Cables.
| Electrical Property | Value |
|---|---|
| Surface Resistance (Ohm) (ASTM-D257 at 45% rH, 23°C)a | ≤ 109 |
| Charge Decay (sec.) (DIN-EN 1149-5: 2008-04 at 45% rH, 23°C)a Typical (sec.) |
≤ 4 << 1 |
| Voltage Buildup (Volts) (PLFWI-2730 up to 1000 Cycles)a | ≤ 100 |
a Test method details available upon request. Results may vary under different conditions.
| Mechanical / Environmental Property | Value |
|---|---|
| Jacket Material | Expanded PTFE Composite |
| Jacket Color | White |
| Flex Life (Cycles) (BR. 50 mm up to 4G Accelerations) | > 10 Million |
| Operating Relative Humidity (rH %) | 45 ± 15 |
| Operating Temperature (°C) | 23 ± 5 |
| Cleanliness Class (ISO 14644-1 up to 1 Mio Flex Cycle)b | Class 1 |
b Based on Anti-ESD Trackless Cable, GKT-FTFH-01-A, Serial Number 14111802. Qualification report available upon request.
Resources
Portfolio: GORE® High Flex Cables for Semiconductor Applications
Data Sheets, 1.35 MB
Tech Note: Understanding Cable Stress and Failure in High Flex Applications
Technical Information
Cable Particulation Study for Cleanroom Environments
White Papers, 751.38 KB
Recent News
Gore is exhibiting virtually at this year’s International Microwave Symposium (IMS), and you’re invited to visit our virtual booth. We’ll describe how our proven portfolio of durable microwave/RF test assemblies delivers stable and consistent performance for reliable 5G test results.
Due to the ongoing challenge of COVID-19, IMS2020 has been moved to virtual with live streaming. A key topic at the symposium is 5G connectivity, and Gore will present a portfolio of reliable microwave/RF test assemblies for 5G testing. We’ll describe how our cable assemblies provide durable, stable, and consistent performance to ensuring accurate and reliable testing results.
Visit us in Booth E7239 at the 2018 SEMICON China to see our latest innovative solutions for the semiconductor and microelectronics industry.
FOR INDUSTRIAL USE ONLY
Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.