GORE® Trackless High Flex Cables for Semiconductor Production Equipment
Lightweight, self-supporting cables eliminate a cable carrier track or chain for a simpler cable management system and solve challenges with particulation, vibration, size and weight. Our cables have a smooth motion for increased positioning accuracy, faster speeds, easier installation and cleaner operation. They can help semiconductor fabricators improve throughput and yield, reducing maintenance and total cost of ownership.
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Resource Library
Portfolio: GORE® High Flex Cables for Semiconductor Applications
Data Sheets, 1.35 MB
As chips become smaller and more powerful, higher levels of process cleanliness and data rates continue to increase in semiconductor and FPD equipment. W. L. Gore & Associates offers proven solutions with more durability, flexibility and reliability that solve these complex issues to increase throughput and yield, reduce maintenance and total costs, and be ready for the future.
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All Resources For GORE® Trackless High Flex Cables for Semiconductor Production Equipment
- Data Sheets (3)
Product Overview
INCREASE THROUGHPUT & YIELD, REDUCE TOTAL COST OF OWNERSHIP
Manufacturers want cable solutions offering cleanliness and durability that help automated equipment to operate at the highest speeds and output with more precision and less downtime.
GORE Trackless High Flex Cables deliver increased positioning accuracy with faster speeds, smooth linear motion, as well as easier installation and cleaner operation. These self-supporting cables eliminate cable chains or conveyors. And they can solve many problems related to particulation, vibration, size, weight and costly maintenance caused by traditional cable chains and tracks.
Using our robust trackless high flex cable in automated equipment allows manufacturers to reduce overall system footprint, increase throughput and yield, decrease maintenance and reduce total costs
SIMPLER CABLE MANAGEMENT SYSTEM
We combine electrical and pneumatic lines into one low-profile trackless flexible cable assembly for a simpler cable management system. Our cables’ flat construction helps reduce the total weight of the moving cable system by eliminating cable chains. Manufacturers can even stack multiple layers of our cables to reduce the overall system footprint.
When it comes to the size of a flat cable versus round cable, the durable materials in our flat cables are 1/2 to 1/3 the thickness of most round cables and meet UL requirements for safety and flame resistance. With a proven flex life under a tight bend radius, these lightweight cables make installation much easier and have performance characteristics that give system designers peace of mind.
Reduce Particulation
Certified to ISO Class 1, GORE Trackless High Flex Cables can be reliably used in cleanroom environments that require low particulation. Using the calculations defined in VDI Guideline 2083 and ISO 14644-1, the Fraunhofer Institute in Germany determined our low-particulation cable has less than 0.1% probability of emitting particulates. They maintain low particulation levels for repeated flexing.
Get more details about the Cable Particulation Study for Cleanroom Environments from the Fraunhofer Institute.
Applications
With proven high flex life and reliability, GORE Trackless High Flex Cables are used in a variety of semiconductor production equipment, including:
- cleanroom automation
- advanced packaging equipment
- front-end wafer inspection
- wafer metrology equipment
- semiconductor automated optical inspection (AOI)
- semiconductor processing equipment
- linear motion stages
- pick & place equipment
- wafer handling
- flat panel display (FPD) manufacturing equipment
- CMOS image sensor (CIS) packaging equipment
- lens manufacturing equipment
Have a new moving cable system that requires a solution with proven long-term high flex performance and reliability? Contact us today to see how we can meet your system needs and requirements.
Features & Benefits
We’ve engineered GORE Trackless High Flex Cables with unique features that make them more durable in demanding cleanroom environments, including:
- flat cable construction eliminates the need for cable chain
- low-friction, non-particulating materials
- temperature-resistant, chemically inert materials
For semiconductor automation equipment suppliers, our low-vibration cables provide many benefits that ensure their reliability, like:
- certified for ISO Class 1 cleanroom environments
- increased throughput and yield
- less maintenance, downtime and total cost of ownership
- minimize vibration for higher positioning accuracy
- reliable signal integrity
- fully custom flex cable solutions
- easy installation with mounting clamps
Are you wondering if your automation equipment can benefit from our trackless cables? Contact us today so we can talk more about how our product can help.
Technical Specs
These values demonstrate the electrical, mechanical and environmental performance of GORE Trackless High Flex Cables for semiconductor production equipment in cleanroom environments.
| Elec. / Mech. / Environ. Property | Value |
|---|---|
| Maximum Acceleration g (m/sec2) | 4.0 (40) |
| Speed m/sec | 4.0 |
| Jacket Material | Expanded PTFE (ePTFE) Composite |
| Jacket Color | White |
| Core Types | Signal, Power, Fiber Optic, Pneumatics |
| Maximum Self-Supporting Stroke Lengtha mm (in) | 1500 (60) |
| Overall Widthb mm (in) | Up to 105 (4.1) |
| Minimum Bend Radiusb mm (in) | 50 (2) |
| Flex Life (Cycles) (BR. 50 mm up to 4G Acceleration) | > 10 million |
| Temperature Range °C | -40 to +80 |
| Cleanliness Class (ISO14664-1 up to 1 Mio Flex Cycle) | 1 |
| Certificationsc | UL, CE |
| Particulationd % (ISO14664-1 / VDI Guideline 2083) | < 0.1 |
a. Baseplate required.
b. Standard version only.
c. UL Style 21090: 80°C, pneumatic tubes are not UL recognized.
d. Details about the Cable Particulation Study for Cleanroom Environments from the Fraunhofer Institute are available at gore.com/particulation.
How to Customize or Buy
Lightweight, reliable GORE Trackless High Flex Cables are offered in standard or customized configurations with mounting clamps for semiconductor production equipment in cleanroom environments.
To customize your own cable, use our design guide and follow a few easy steps to choose from the most common industry components that meet your specific application needs and requirements. Once you submit your information, a Gore representative will review your requirements, contact you with a recommendation and provide a drawing.
If you need help designing your trackless cable or to discuss your specific equipment needs, contact us today.
Resources
Portfolio: GORE® High Flex Cables for Semiconductor Applications
Data Sheets, 1.35 MB
Cable Particulation Study for Cleanroom Environments
White Papers, 751.38 KB
View all resources for GORE Trackless High Flex Cables for Semiconductor Production Equipment
Recent News
Clean Gore cables & assemblies: Made for lithography. Made for you. Gore’s custom-configured static and high-flex cables & cable assemblies are designed, engineered and manufactured to meet the lithography industry’s toughest standards for durability, outgassing performance, cleanliness and flexibility. We look forward to seeing you at Precisiebeurs 2022.
Gore is exhibiting virtually at this year’s International Microwave Symposium (IMS), and you’re invited to visit our virtual booth. We’ll describe how our proven portfolio of durable microwave/RF test assemblies delivers stable and consistent performance for reliable 5G test results.
Due to the ongoing challenge of COVID-19, IMS2020 has been moved to virtual with live streaming. A key topic at the symposium is 5G connectivity, and Gore will present a portfolio of reliable microwave/RF test assemblies for 5G testing. We’ll describe how our cable assemblies provide durable, stable, and consistent performance to ensuring accurate and reliable testing results.
Visit us in Booth E7239 at the 2018 SEMICON China to see our latest innovative solutions for the semiconductor and microelectronics industry.
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Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.