Press Release
Posted April 21, 2017
W. L. Gore & Associates (Gore) will be featuring the new GORE® PHASEFLEX® Microwave/RF Test Assemblies, Type 0N for High Density Test/Interconnection at EDICON China 2017 in Shanghai, April 25-27, booth number 319.
GORE® Packaging Vents’ new Standard Series provides improved GORE™ Membrane technology in a full-surface foam liner construction. The Standard Series brings added versatility, economy and safety to a wide range of more typical or “everyday” packaging applications.
GORE® Packaging Vents’ new High Roll-Off Series delivers our most advanced membrane technology in a full-surface foam liner, to achieve a new level of resistance to container deformation and leaks – especially for applications where your most hazardous or aggressive chemicals are exposed to the most extreme conditions during storage, transport or handling.