Resource Library

Read the interview with Greg Powers, Global Aerospace and Defense Market Leader with W. L. Gore & Associates, about the company’s proven reliable solutions for high-performance digital and microwave connectivity and other products.

During launches and missions, reducing the total mass of a spacecraft is essential to add more payload and fit more critical systems and subsystems. W. L. Gore & Associates meets the challenge with the smallest, lightest low earth orbit (LEO) wires and cables qualified to ESCC 3901/026 specifications and registered on the ESA Qualified Parts List (QPL).

Gore provides high-performance cable assemblies with significant mechanical and electrical advantages for high-flex applications in aerospace and defense, spaceflight, semiconductor, and test and measurement environments.

SMA, 3.5 mm and 2.92 mm connectors make reliable, RF components and instrumentation possible. These seemingly mundane devices are the result of evolutionary and revolutionary design, covering a 40-year period and involving several corporations. In their present state, they represent highly evolved, well-defined interface systems.

The importance of a microwave cable assembly’s shielding effectiveness cannot be understated. Across defense, civil, and aerospace applications, it impacts the system performance of the aircraft and could impede upon data transmission capabilities.

If you determine that your system may be affected by PIM distortion, there are a few basic guidelines you can use to minimize PIM generation.

GORE® Spaceflight Cables are engineered to withstand the severe levels of radiation found in many satellite applications.

Unless otherwise specified, every GORE® Microwave/RF Coaxial Assembly is 100% tested, inspected, and certified to meet the acceptance requirements contained in all applicable specifications, whether stated in literature or in pre-approved customer contracts.

For both Spaceflight and Non-Spaceflight applications.

This technical document details tracking changes in insertion loss and phase length with temperature.