GORE™ ZD Cable Assemblies combine Gore's high-data-rate digital cable assembly technology with the ZD high-speed connector to offer an interconnect that delivers exceptional signal fidelity and reliability at bandwidths of five Gb/s and higher. The assemblies come in a variety of cable sizes and custom pin-out configurations, and are available in either cable or backplane header-compatible versions. EMI backshells can also be incorporated to provide a complete interconnect solution for external cabling requirements.
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| Differential impedance | 100Ω ±5Ω* |
| Multi line cross talk | ‹5% * |
| Pitch between signals (within pair) | 1.5mm |
| Pitch between pairs (within wafer) | 4.5mm |
| Pitch between wafers | 2.5mm |
| Mating pin length | 3.8, 5.8mm |
* at 100ps rise time