GORE® ZD Assemblies
These assemblies come in a variety of cable sizes and custom pin-out configurations, and are available in either cable or backplane header-compatible versions.
GORE ZD Assemblies

GORE® ZD Assemblies

GORE® ZD Assemblies combine Gore's high-data-rate digital cable assembly technology with the ZD high-speed connector to offer an interconnect that delivers exceptional signal fidelity and reliability at bandwidths of five Gb/s and higher. The assemblies come in a variety of cable sizes and custom pin-out configurations, and are available in either cable or backplane header-compatible versions. EMI backshells can also be incorporated to provide a complete interconnect solution for external cabling requirements.

Cable Connector Specifications

Differential impedance 100Ω ±5Ω*
Multi line cross talk ‹5% *
Pitch between signals (within pair) 1.5mm
Pitch between pairs (within wafer) 4.5mm
Pitch between wafers 2.5mm
Mating pin length 3.8, 5.8mm

* at 100ps rise time


  • How to Buy

    How to Buy

    For more information about buying this product or to request a quote, please contact us.