EMI Shielding & Grounding Solutions - Mobile Electronics
The Supersoft Series of GORE® SMT EMI Gaskets and Grounding Pads are standard components that enable designers to create EMI shields in non-linear 2-D or 3-D shapes, reduce device thickness where EMI cans are used, and create grounding points as needed in a very small footprint on the circuit board.
Technical Information, 246.93 KB
GORE® SMT EMI Gaskets and Grounding Pads offer a full spectrum of working ranges, making them ideal for use as grounding pads, EMI gaskets, and antenna contacts.
Technical Information, 672.1 KB
All components of GORE® SMT EMI Gaskets and Grounding Pads, including carrier tape, cover tape, and reels are packaged according to EIA 481.
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