Exceptional EMI protection with easy SMT integration
In automotive electronic devices, grounding and shielding products must ensure electrical performance without breaking under severe mechanical and environmental stress throughout the vehicle service life. But, metal spring contacts and clips typically create single point contact that can fatigue over time and decrease electrical performance after exposure to vibration, shock, extreme temperatures and other challenging road conditions. Also, metal contacts can scratch mating surfaces damaging the device enclosure and generating conductive particles. All of these issues can compromise device performance, which can lead to failure and warranty issues.
GORE SMT EMI Gaskets and Grounding Pads, Supersoft Series delivers excellent electrical performance by providing reliable grounding and shielding in these challenging automotive conditions. These components ensure consistent grounding through a large conformable contact area for low DC resistance throughout the vehicle service life. The patented construction of Gore’s components also reduces the likelihood of enclosure surface abrasion and particulation.
Our Supersoft Series offers a convenient design compatible with surface mount technology (SMT) that can be easily integrated into existing production lines. These off-the-shelf components eliminate the need for custom designs and secondary processing. All of this translates to increased flexibility in your designs, easy installation, faster production rates and lower total costs over time.
Patented construction of Supersoft Series
The Supersoft Series offers significant benefits to designers and process engineers — not only because they shield so effectively, but because they’re easy to integrate. These components provide:
- large conformable contact area for low DC resistance throughout vehicle service life due to patented construction
- reduced electromagnetic interference (EMI) and crosstalk in challenging environments
- reduced likelihood of enclosure surface abrasion and particulation
- increased design flexibility and reduced total costs with easily integrated standard parts versus custom designs
- faster production rates because of consistent and repeatable assembly with SMT-compatible parts
Still have questions about the benefits of our Supersoft Series? Please contact us
GORE SMT EMI Gaskets and Grounding Pads, Supersoft Series has proven very effective for sensitive automotive electronics, where reliability is crucial to keeping drivers and passengers satisfied and safe.
These highly compressible components are soft, conductive on contact, and resilient after compression — making them the ideal solution for automotive applications that require minimal deflection stress and consistent contact, including:
- Advanced driver assistance systems (ADAS)
- Cameras and radar systems
- Connectivity devices
- Infotainment systems
- Instrument cluster control modules
- Navigation systems
- Powertrain electronics
- Telematics control units (TCU)
Additionally, the components’ non-abrasive, patented construction enables tolerance take-up that maintains contact without damaging the integrity of the enclosure surface.
GORE SMT EMI Gaskets and Grounding Pads, Supersoft Series shields sensitive automotive electronics systems from electromagnetic interference while protecting them against shock, vibration and environmental factors. The combination of a highly compressible construction and minimal force requirements make these components an excellent choice for use with metallized plastic housings and a variety of components.
The traditional designs of pogo pins and universal clips can easily break. The robust design of the Supersoft Series, with a large contact surface rather than a single point contact, increases durability over time. The Supersoft Series is conductive on contact and resilient after compression.
We offer two versions in the series, which differ by thickness, size, compression and other factors.
|Gore Part Number||25SMT-4442-01 REV A||25SMT-4442-03 REV A|
|Compressed Part Height (mm)||1.48||2.20|
|DC Resistance (ohms)||0.008||0.012|
|Force to Achieve Compression (N)||0.9||1.8|
|Compressed Part Height (mm)||1.19||1.90|
|DC Resistance (ohms)||0.006||0.011|
|Force to Achieve Compression (N)||2.3||3.6|
|Compressed Part Height (mm)||0.90||1.60|
|DC Resistance (ohms)||0.009||0.011|
|Force to Achieve Compression (N)||7.0||6.2|
Please review what differentiates our two versions of the Supersoft Series, and contact us with any questions.
Design Guide: GORE® SMT EMI Gaskets and Grounding Pads - Supersoft Series for Automotive Electronics
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