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Home > Products > Electronic & Electrochemical Materials > Specialty Electronic Products > Thermal Interface Materials
Thermal Interface Materials
 GORE™ POLARCHIP™ Thermal Interface Materials (TIMs) are the most compressible and conformable thermal gap fillers available. These pads are ideal for applications where gaps between heat sinks and heat-generating components are highly variable due to tolerance stack-ups or uneven component heights. As a result of its compressibility and ability to accommodate loose flatness tolerances, GORE™ POLARCHIP™ TIMs minimize the extreme stresses to components and can eliminate secondary heat sink machining operations.
GORE™ POLARCHIP™ TIMs are based on boron-nitride-filled ePTFE technology; are low in silicone content, and are available in several grades and thicknesses, depending on softness and thermal requirements. All of the GORE™ POLARCHIP™ TIMs are provided in die-cut form with a pressure-sensitive adhesive, and they are strong and easy to handle. Gore also offers cost-effective peel-and-stick automated installation solutions to meet most manufacturing requirements
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GORE™
POLARCHIP™
TIM
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Available thickness (mm)*
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Compression
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Thermal Resistance
°Ccm2/W
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Thermal Conductivity
W/mK
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Max. Operating Temp.
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0.25
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0.50
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0.75
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1.00
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1.50
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2.00
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3.00
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(values for 0.50 mm thick, @ 50 psi)
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CP6000
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•
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•
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•
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•
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•
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26%
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5.8
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1.2
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200°C
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CP8000
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•
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•
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•
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•
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•
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61%
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5.2
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0.7
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110°C
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*Other thicknesses available upon request
Flammability rating (UL94): • V-0, • V-1, • HB
CP6000 was previously known as M20 Thermal Interface Material
Advantages
- Highly compressible with low stresses
- Excellent thermal conductivity and resistance
- Many grades and thicknesses available
- Automated installation
- Low silicone content
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