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Home > Products > Electronic & Electrochemical Materials > EMI Shielding > Board Level EMI Shielding Solutions > Case Histories

Case Histories : Board Level EMI Shielding Solutions

 

1: Case Study: GORE™ snapSHOT® Low Frequency Shielding
In the article titled “Removable Shielding Technologies for PCBs”, found in the January 2006 issue of Evaluation Engineering magazine, the GORE™ snapSHOT® shield was compared to several PCB level shielding technologies. The data shown in article was taken using a mode-stirred reverberation chamber that has a lower operating frequency of 1 GHz. There has since been interest in knowing the shielding performance below 1 GHz for this novel PCB-level shielding technology that Gore offers.
2: Case Study: GORE™ snapSHOT® Reliability
The electronics industry frequently evaluates the reliability of EMI shielding performance by subjecting materials to various thermal and mechanical stresses. Electrical measurements are made before and after these stresses to determine the level of change. Gore has evaluated the electrical performance of GORE™ snapSHOT® EMI Shields before and after mechanical shock, thermal shock, and bump and vibration.
3: Case Study: GORE™ snapSHOT® Shield Test Kit
A demonstration printed circuit board (PCB) was developed to allow customers to measure the shielding effectiveness of the GORE™ snapSHOT® shield as a fully integrated “board-level” shielding device. This test board incorporates both a removable-lid can and a single cavity GORE™ snapSHOT® shield so the user can evaluate the shielding effectiveness of both solutions.


 

 


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