Case Study: GORE™ snapSHOT® EMI Shield Reliability

The electronics industry frequently evaluates the reliability of EMI shielding performance by subjecting materials to various thermal and mechanical stresses. Electrical measurements are made before and after these stresses to determine the level of change. Gore has evaluated the electrical performance of GORE™ snapSHOT® EMI Shields before and after the following types of stress conditions:

• Mechanical Shock: JEDEC Standard JESD22-B104-B
• Thermal Shock: MIL Spec 883E-1010.7B – 10 cycles
• Bump and Vibration: IEC-68-2-29 and IEC-68-2-64

Read the Study:

Case Study: GORE™ snapSHOT® EMI Shield Reliability (476 KB PDF)