Electronic & Electrochemical Materials

GORE™ snapSHOT® Board-Level EMI Shield




GORE™ SNAPSHOT® EMI Shield is a multi-cavity, lightweight solution that can be thermoformed to virtually any design. The innovative attachment mechanism uses solder spheres as individual mechanical snap features that ensure reliable product performance.

The design and construction of GORE™ SNAPSHOT® EMI Shield increases available space within the enclosure in a variety of ways compared to traditional metal cans or frame-and-lid technology. Designers who opt for thermoformed shields at the outset of a design project can focus on effective board design without being limited by the shape and construction of their EMI shields. 


snapSHOT Application Guide

GORE® SNAPSHOT® Board-Level EMI Shield Application Guide

Download PDF (597 KB)

Features and Benefits

  • Superior shielding performance
  • Board design flexibility
  • Snap-on attachment mechanism
  • Easy component inspection or repair
  • Shielding effectiveness up to 75 dB


Nominal Properties

Shield Material Property Value Method
Thickness 0.125 mm -
Shielding Effectiveness 75 dB ASTM D4935
Surface Resistivity 0.025 Ohms/square ASTM F390
Metallization Adhesion 5B ASTM D3359
Metallization Thickness 5 microns SEM
Dielectric Strength 80 kV/mm ASTM D149
Vicat Softening Temp. B 215 C ASTM D1525
Flammability VTM -0 UL 94
Solder Sphere Property Value Method
Sphere Diameter 0.89 mm -
Sphere-to-Sphere Spacing 2.0 mm -
Ground Pad Diameter 0.60 mm -

Shielding Effectiveness