W.L.Gore & Associates, Inc.
Electronic & Electrochemical Materials
GORE™ snapSHOT® Board-Level EMI Shield
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How to Buy
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GORE™ SNAPSHOT® EMI Shield is a multi-cavity, lightweight solution that can be thermoformed to virtually any design. The innovative attachment mechanism uses solder spheres as individual mechanical snap features that ensure reliable product performance.
The design and construction of GORE™ SNAPSHOT® EMI Shield increases available space within the enclosure in a variety of ways compared to traditional metal cans or frame-and-lid technology. Designers who opt for thermoformed shields at the outset of a design project can focus on effective board design without being limited by the shape and construction of their EMI shields.
Features and Benefits
- Superior shielding performance
- Board design flexibility
- Snap-on attachment mechanism
- Easy component inspection or repair
- Shielding effectiveness up to 75 dB
GORE™ snapSHOT® Board-Level EMI Shield Application Case Studies
Nominal Properties
| Shield Material Property | Value | Method |
|---|---|---|
| Thickness | 0.125 mm | - |
| Shielding Effectiveness | 75 dB | ASTM D4935 |
| Surface Resistivity | 0.025 Ohms/square | ASTM F390 |
| Metallization Adhesion | 5B | ASTM D3359 |
| Metallization Thickness | 5 microns | SEM |
| Dielectric Strength | 80 kV/mm | ASTM D149 |
| Vicat Softening Temp. B | 215 C | ASTM D1525 |
| Flammability | VTM -0 | UL 94 |
| Solder Sphere Property | Value | Method |
| Sphere Diameter | 0.89 mm | - |
| Sphere-to-Sphere Spacing | 2.0 mm | - |
| Ground Pad Diameter | 0.60 mm | - |
Shielding Effectiveness