GORE™ snapSHOT® Board-Level EMI Shield

GORE™ snapSHOT® Board-Level EMI Shield is a revolutionary, multicavity, board-level EMI shielding product for wireless communication devices. The technology consists of a lightweight, metallized plastic shield that is thermoformed to virtually any design, and an innovative attachment mechanism using solder spheres as individual mechanical snap features.

The shield is metallized with tin on the outside only (leaving the inside surface insulative), which results in narrower ground traces, less space between components, and reduced overall thickness when compared to existing shielding solutions.

Solder spheres are reliably installed to ground pads on the PCB, directly after solder paste is applied, using a modified stencil printer.  The rest of the SMT process, including pick-and-place and reflow, remains unaffected.

GORE™ snapSHOT® Shields are snapped on to the PCB after reflow, allowing for easy component inspection or repair, and are easily removable by hand.  Manual, semi, or fully-automated installation solutions are available.

Applications for GORE™ snapSHOT® Shielding Technology include:  mobile phones, PDA's, WLAN, bluetooth, laptop computers, and anywhere soldered cans or EMI gaskets are used.  GORE™ snapSHOT® Shields provide these devices with excellent protection against EMI and overcome many of the limitations of both soldered metal cans and elastomeric gaskets.