GSM Patch Antenna Interconnect

Application

A leading European manufacturer of GSM handsets needed a low-cost, shielded interconnect for patch antennas.

Summary

Conventional beryllium copper springs were too noisy and required increased shielding in other areas of the handset. A coaxial interconnect provided a quiet signal path, but was too expensive for this high-volume handset application.

Results

GORE-SHIELD™ SMT RF grounding pads provided a cost-effective solution. At a cost similar to that of beryllium copper spring contacts, GORE-SHIELD grounding pads delivered 30-40 dB of noise reduction. Installation cost and time were very low because GORE-SHIELD grounding pads are SMT-compatible. The low profile of the GORE-SHIELD interconnect was an added benefit, allowing for a thinner handset and reducing circuit inductance by bringing the antenna ground closer to the PCB ground.