GORE-SHIELD® SMT Compatible Grounding Pads
 GORE-SHIELD® SMT Grounding Pads are electrically conductive pads that provide reliable contact points on a printed circuit board. They are comprised of a conformable electrically conductive gasket material bonded to a thin, solderable metal support layer via an electrically conductive adhesive. The gasket material consists of a polytetrafluroethylene (PTFE) matrix loaded with highly conductive nickel-based particles.
GORE-SHIELD® SMT Grounding Pads are rectangular in shape and available in a variety of standard lengths and widths so that they can be easily configured on PCB ground traces in whatever patterns and locations the design requires. GORE-SHIELD® SMT Grounding Pads are packaged in standard EIA tape-and-reel format for automated placement and reflow soldering via standard surface mount technology and processes.
Benefits
- Available in standard sizes, off-the-shelf
- Configurable in any pattern to be placed in any location
- Easily incorporated into existing designs to address issues that appear late in the design cycle, eliminating the need for redesign
- Compatible with standard and lead-free solder reflow
- Requires no special equipment; Implemented with existing pick-and-place and reflow soldering technologies and processes
- Demonstrated pick-and-place rates of 8-10 parts/second
- Low cost and high performance in comparison with other technologies
Proven Applications
Applications for GORE-SHIELD® SMT Grounding Pads include:
- RF Grounding
- DC Grounding
- Static Dissipation
- RF Interconnect
- EMI/RFI Shield Gasket
Specific, proven applications for GORE-SHIELD® SMT Grounding Pads include: chassis to PCB grounding, component to PCB grounding, LCD display grounding, and patch antenna grounding.
GORE-SHIELD® SMT Grounding Pads Datasheet (PDF file, 91 KB)
For more information or to request samples, please contact us.
Covered by One or More of the Following Patents:
US 6,255,581 B1
US 7,129,421 B2
US 6,210,789 B1
Other US Patents Pending
Corresponding Foreign Patents Issued and Pending
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GORE-SHIELD® Supersoft SMT EMI Grounding Pad Parts
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Nominal Properties (mm unless otherwise specified)
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Gore Part Number 25SMT-4442-
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Length
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Width
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Thickness
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Carrier Tape Width x Pitch
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Parts per Reel
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RCS*
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Resistance at RCS (mOhm)
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-01
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3.6
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1.7
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1.6
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12x4
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6,500
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1.35
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29
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-03
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3.6
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2.6
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2.4
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12x4
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6,500
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1.95
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35
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-04
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8.1
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2.5
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2.5
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16x4
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6,500
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1.95
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10
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GORE-SHIELD® Standard SMT EMI Grounding Pad Parts
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Nominal Properties (mm unless otherwise specified)
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Gore Part Number 25SMT-3645-
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Length
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Width
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Thickness
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Carrier Tape Width x Pitch
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Parts per Reel
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RCS*
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Resistance at RCS (mOhm)
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-9
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5.50
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1.25
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0.65
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12x4
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15,000
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0.52
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2.0
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-10
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8.00
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1.25
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0.65
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16x4
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15,000
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0.52
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2.0
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-11
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12.00
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1.25
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0.65
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24x4
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15,000
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0.52
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2.0
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-13
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5.50
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1.25
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0.45
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12x4
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15,000
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0.36
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2.0
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-14
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8.00
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1.25
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0.45
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16x4
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15,000
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0.36
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2.0
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-17
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5.50
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1.10
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0.65
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12x4
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15,000
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0.52
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2.0
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-18
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8.00
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1.10
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0.65
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16x4
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15,000
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0.52
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2.0
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-21
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5.50
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1.10
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0.45
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12x4
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15,000
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0.36
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2.0
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-22
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8.00
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1.10
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0.45
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16x4
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15,000
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0.36
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2.0
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-25
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12.00
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2.00
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0.65
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24x4
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15,000
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0.52
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2.0
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-26
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8.00
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2.00
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0.65
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16x4
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15,000
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0.52
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2.0
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-27
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5.50
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2.00
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0.65
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12x4
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15,000
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0.52
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2.0
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-33
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3.20
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1.10
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0.65
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12x4
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15,000
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0.52
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3.0
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-34
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5.50
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0.90
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0.45
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12x4
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15,000
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0.36
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2.0
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-35
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8.00
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0.90
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0.45
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16x4
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15,000
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0.36
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2.0
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-40
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5.50
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1.25
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0.80
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12x4
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10,000
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0.64
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2.0
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-41
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3.20
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1.25
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0.80
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12x4
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10,000
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0.64
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4.0
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-43
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3.20
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3.20
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1.30
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12x8
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5,000
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1.04
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3.0
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-44
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8.00
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2.00
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1.30
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16x4
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7,500
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1.04
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2.0
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-46
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3.20
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3.20
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2.00
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12x8
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2,500
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1.60
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2.0
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-47
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8.00
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2.25
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2.00
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16x4
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5,000
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1.60
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2.0
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*Recommended compression stop
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