GORE-SHIELD® SMT Compatible Grounding Pads
GORE-SHIELD® SMT Grounding Pads are electrically conductive pads that provide reliable contact points on a printed circuit board. They are comprised of a conformable electrically conductive gasket material bonded to a thin, solderable metal support layer via an electrically conductive adhesive. The gasket material consists of a polytetrafluroethylene (PTFE) matrix loaded with highly conductive nickel-based particles.
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How to Buy
To purchase this product or request a quote, please contact an authorized Gore distributor.
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GORE-SHIELD® SMT Grounding Pads are rectangular in shape and available in a variety of standard lengths and widths so that they can be easily configured on PCB ground traces in whatever patterns and locations the design requires. GORE-SHIELD® SMT Grounding Pads are packaged in standard EIA tape-and-reel format for automated placement and reflow soldering via standard surface mount technology and processes.
Benefits
- Available in standard sizes, off-the-shelf
- Configurable in any pattern to be placed in any location
- Easily incorporated into existing designs to address issues that appear late in the design cycle, eliminating the need for redesign
- Compatible with standard and lead-free solder reflow
- Requires no special equipment; Implemented with existing pick-and-place and reflow soldering technologies and processes
- Demonstrated pick-and-place rates of 8-10 parts/second
- Low cost and high performance in comparison with other technologies
Proven Applications
Applications for GORE-SHIELD® SMT Grounding Pads include:
- RF Grounding
- DC Grounding
- Static Dissipation
- RF Interconnect
- EMI/RFI Shield Gasket
Specific, proven applications for GORE-SHIELD® SMT Grounding Pads include: chassis to PCB grounding, component to PCB grounding, LCD display grounding, and patch antenna grounding.
Samples are available upon request.
Covered by One or More of the Following Patents:
US 6,255,581 B1
US 7,129,421 B2
US 6,210,789 B1
Other US Patents Pending
Corresponding Foreign Patents Issued and Pending
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GORE-SHIELD® Supersoft SMT EMI Grounding Pad Parts |
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Nominal Properties (mm unless otherwise specified) |
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Gore Part Number 25SMT-4442- |
Length |
Width |
Thickness |
Carrier Tape Width x Pitch |
Parts per Reel |
RCS* |
Resistance at RCS (mOhm) |
|
-01 |
3.6 |
1.7 |
1.6 |
12x4 |
6,500 |
1.35 |
29 |
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-03 |
3.6 |
2.6 |
2.4 |
12x4 |
6,500 |
1.95 |
35 |
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-04 |
8.1 |
2.5 |
2.5 |
16x4 |
6,500 |
1.95 |
10 |
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GORE-SHIELD® Standard SMT EMI Grounding Pad Parts |
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Nominal Properties (mm unless otherwise specified) |
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Gore Part Number 25SMT-3645- |
Length |
Width |
Thickness |
Carrier Tape Width x Pitch |
Parts per Reel |
RCS* |
Resistance at RCS (mOhm) |
|
-9 |
5.50 |
1.25 |
0.65 |
12x4 |
15,000 |
0.52 |
2.0 |
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-10 |
8.00 |
1.25 |
0.65 |
16x4 |
15,000 |
0.52 |
2.0 |
|
-11 |
12.00 |
1.25 |
0.65 |
24x4 |
15,000 |
0.52 |
2.0 |
|
-13 |
5.50 |
1.25 |
0.45 |
12x4 |
15,000 |
0.36 |
2.0 |
|
-14 |
8.00 |
1.25 |
0.45 |
16x4 |
15,000 |
0.36 |
2.0 |
|
-17 |
5.50 |
1.10 |
0.65 |
12x4 |
15,000 |
0.52 |
2.0 |
|
-18 |
8.00 |
1.10 |
0.65 |
16x4 |
15,000 |
0.52 |
2.0 |
|
-21 |
5.50 |
1.10 |
0.45 |
12x4 |
15,000 |
0.36 |
2.0 |
|
-22 |
8.00 |
1.10 |
0.45 |
16x4 |
15,000 |
0.36 |
2.0 |
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-25 |
12.00 |
2.00 |
0.65 |
24x4 |
15,000 |
0.52 |
2.0 |
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-26 |
8.00 |
2.00 |
0.65 |
16x4 |
15,000 |
0.52 |
2.0 |
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-27 |
5.50 |
2.00 |
0.65 |
12x4 |
15,000 |
0.52 |
2.0 |
|
-33 |
3.20 |
1.10 |
0.65 |
12x4 |
15,000 |
0.52 |
3.0 |
|
-34 |
5.50 |
0.90 |
0.45 |
12x4 |
15,000 |
0.36 |
2.0 |
|
-35 |
8.00 |
0.90 |
0.45 |
16x4 |
15,000 |
0.36 |
2.0 |
|
-40 |
5.50 |
1.25 |
0.80 |
12x4 |
10,000 |
0.64 |
2.0 |
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-41 |
3.20 |
1.25 |
0.80 |
12x4 |
10,000 |
0.64 |
4.0 |
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-43 |
3.20 |
3.20 |
1.30 |
12x8 |
5,000 |
1.04 |
3.0 |
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-44 |
8.00 |
2.00 |
1.30 |
16x4 |
7,500 |
1.04 |
2.0 |
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-46 |
3.20 |
3.20 |
2.00 |
12x8 |
2,500 |
1.60 |
2.0 |
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-47 |
8.00 |
2.25 |
2.00 |
16x4 |
5,000 |
1.60 |
2.0 |
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*Recommended compression stop |
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