Grounding Pad Solutions
As electronic devices have more functionality incorporated into smaller and smaller form factors, printed circuit board layout is increasing in complexity, and designers have less space to work with. These challenges result in the need of additional grounding points to help eliminate noise, reflections, and other associated EMI phenomena that can compromise device performance.
Gore offers a variety of grounding solutions in a range of material sets that offer high electrical conductivity, reliability through harsh conditions, and properties that allow for accommodation of existing design constraints.
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How to Buy
To purchase this product or request a quote, please contact an authorized Gore distributor.
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EMI Product Selection Guide
A comparison of features, product forms, and available configurations for Gore EMI gaskets and grounding pads.
- Surface-Mount (SMT) Compatible EMI Grounding Pads
- GORE-SHIELD® SMT Grounding Pads are electrically conductive pads that provide reliable contact points on a printed circuit board.
- Adhesive Backed Grounding Pads
- Gore's adhesive backed EMI grounding pads (GS8000 Series) are ideal where conformability, high conductivity, and low compressive forces are required.