Grounding Pad Solutions

As electronic devices have more functionality incorporated into smaller and smaller form factors, board layout is increasing in complexity, and designers have less space to work. These challenges result in the need, many times in the final design stages, of additional grounding points to help eliminate noise, reflections, and other associated EMI phenomena that can compromise device performance.

Gore offers a variety of grounding solutions in a range of material sets that offer high electrical conductivity, reliability through harsh conditions, and properties that allow for accommodation of existing design constraints.

SMT Compatible	Adhesive-Backed
Conductive foams and filled tapes Adhesive-backed with conductive PSA Die-cut options in many forms through conversion network High shielding effectiveness/low DC resistance Ideal for component to component and component to PCB grounding Learn More	Conductive extrusions and filled tapes Standard part sizes Placed with standard surface mount technology (SMT) Capable of undergoing lead-free solder reflow Ideal for component to PCB grounding Learn More