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Home > Products > Electronic & Electrochemical Materials > EMI Shielding > Grounding Pad Solutions > Adhesive-Backed Grounding Pads > GS8000 Adhesive-Backed Grounding Pads

GORE-SHIELD® GS8000 Adhesive-Backed Grounding Pads

GORE-SHIELD GS8000 Grounding Pads

GORE-SHIELD® GS8000 Conductive Foam is ideal for applications such as grounding pads where conformability, high conductivity, and low compressive forces are required.

GORE-SHIELD® GS8000 Conductive Foam can be supplied as die-cut parts on rolls for high-volume assembly. This material is ideal for the cellular phone, PDA, and portable computing market.

GORE-SHIELD® GS8000 Conductive Foam consists of a nickel-plated, conductive polyurethane foam, a conductive pressure sensitive adhesive, a copper foil, another conductive pressure sensitive adhesive, and a PET carrier film.

Applications

RF and static grounding for mobile phones, PDAs, portable computing, or other portable devices.

Features and Benefits

  • Low DC resistance
  • Excellent reliability through Accelerated Life Testing (ALT)
  • Excellent gap tolerance take-up
  • Conformable and highly compressive with low force
  • Compensates for materials with large tolerances

GORE-SHIELD® GS8000 Grounding Pads Datasheet (PDF file, 173KB)

For more information or to request samples, please contact us.


 

 


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