Electronic & Electrochemical Materials

GORE-SHIELD® GS8000 Adhesive-Backed Grounding Pads


GORE-SHIELD® GS8000 Adhesive-Backed Grounding Pads

GORE-SHIELD® GS8000 EMI Grounding Pads are ideal where conformability, high conductivity, and low compressive forces are required. GORE-SHIELD® GS8000 EMI Grounding Pads can be supplied as die-cut parts on rolls for high-volume assembly.



Features and Benefits

  • Low DC resistance
  • Excellent reliability through Accelerated Life Testing (ALT)
  • Excellent gap tolerance take-up
  • Conformable and highly compressive with low force
  • Compensates for materials with large tolerances
  • Available in custom die-cut part or on rolls

Construction

GORE-SHIELD® GS8000 Conductive Foam consists of a nickel-plated, conductive polyurethane foam, a conductive pressure sensitive adhesive, a copper foil, another conductive pressure sensitive adhesive, and a PET carrier film.


GS8000 Closure Force/Shielding Effective Versus % Compression

Chart 1

Once the working height of the compressed pad is established, refer to Chart 1 to determine which thickness of GORESHIELD® GS8000 Conductive Foam is most suitable. Ideally, designers should strive for 50-75% compression to final stop to ensure consistent RF grounding across the face and through the grounding pad.