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GORE™ SPEEDBOARD® LF (Low Flow) Prepreg

GORE™ SPEEDBOARD® LF Prepreg is the lowest loss, lowest D _k thermoset prepreg compatible with all commercial laminates. This product exhibits controlled X-Y resin flow for superior cost performance in cavity and ridgid-flex designs. The material consists of standard BT resin in a continuous toughening matrix.

Product Attributes

Electrical

• Low loss for high frequency signal integrity
• Low Dk provides faster signal speeds and thinner PCBs
• Stable Dk (2.6) and loss (0.004) from 1 MHz-40 GHz
• Wider traces for higher bandwidth
• Superior thickness uniformity for controlled impedance layers
• Reduced crosstalk with increased routability

Reliability

• High Tg for Pb-free multiple laminations or solder reflows
• Micro reinforced for superior crack resistance
• Excellent adhesion to all commercial cores
• Compatible with Omega-ply
• Low outgassing for space applications

Processing

• Repeatable, low X-Y resin flow for cavity designs
• Fills buried vias during lamination
• Standard high Tg FR4 lamination cycle
• Laser drilling 2-5x faster than glass prepregs

High Density

• Low Dk for thinner boards and improved PTH aspect ratios 
• Minimizes trace "print-through"

Typical Applications

• Combine with halogen free FR4 cores for cost/performance
• Combine with RF laminates for high performance
• Base station power amplifiers and other cavity PCBs
• Cavity modules and packages
• Rigid-flex and flex to install

Material Properties