GORE® SPEEDBOARD® LF (Low Flow) Prepreg
GORE® SPEEDBOARD® LF Prepreg is compatible with all commercial laminates. This product exhibits controlled X-Y resin flow in cavity and ridgid-flex designs. The material consists of standard BT resin in a continuous toughening matrix.
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END-OF-LIFE NOTICE
This is an end-of-life product. Gore will be discontinuing the manufacture and sale of GORE® SPEEDBOARD®, G610, G620, G630, and G410 dielectric materials. These materials should not be incorporated into any new designs or programs. For questions, please contact Gore.
Product Attributes
- Stable Dk (2.6) and loss (0.004) from 1 MHz-40 GHz
- Wider traces for higher bandwidth
- Thickness uniformity for controlled impedance layers
- High Tg for Pb-free multiple laminations or solder reflows
- Micro reinforced for crack resistance
- Compatible with Omega-ply
- Low outgassing for space applications
- Repeatable, low X-Y resin flow for cavity designs
- Fills buried vias during lamination
- Standard high Tg FR4 lamination cycle
Typical Applications
- Combine with halogen free FR4 cores
- Combine with RF laminates
- Base station power amplifiers and other cavity PCBs
- Cavity modules and packages
- Rigid-flex and flex to install
Material Properties
| Property | Unit | Test Condition | Typical Value |
|---|---|---|---|
|
Dielectric constant (Dk) |
- |
Split post resonant cavity (1 MHz–40 GHz) |
2.6 |
|
Loss tangent (Df)
|
- |
Split post resonant cavity (1 MHz–40 GHz) |
0.004 |
|
Peel strength |
Kg/cm (pli) |
17 µm (1/2 oz) VLP foil |
1.1 (6.5) |
|
Solder resistance |
- |
288°C; 6x30 sec |
Pass |
|
CTE (X, Y, Z) |
ppm/°C |
TMA (–55 to +200° C) |
56 |
|
Glass transition temperature |
°C (°F) |
TMA |
220 (428) |
|
Thickness |
(µm) (mil) |
|
57, 86 (2.2, 3.4) |