GORE® SPEEDBOARD® C Prepreg
GORE® SPEEDBOARD® C Prepreg materials are sheets of expanded PTFE impregnated with thermoset resins. The air space inside the expanded PTFE is replaced with resin, and the ePTFE membrane becomes the carrier or the delivery system for the resin. The resin flows, fills, and bonds during the lamination process in the same way as conventional glass-based prepreg.
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END-OF-LIFE NOTICE
This is an end-of-life product. Gore will be discontinuing the manufacture and sale of GORE® SPEEDBOARD®, G610, G620, G630, and G410 dielectric materials. These materials should not be incorporated into any new designs or programs. For questions, please contact Gore.
Material Properties
|
Dielectric constant at 1 MHz–40 GHz |
2.6 |
|
Loss tangent at 1 MHZ–40 GHz |
0.004 |
|
Dielectric strength (V/mil) |
>1,000 |
|
Glass transition temperature Tg (Celsius) |
220 |
|
Resin content (%) |
67-81 |
|
Color |
Opaque tan |
|
Flammability |
UL-94V-0 |
|
Pressed thickness (mils) (µm) |
1.5, 2.0, 2.2, 3.4 (38, 51, 57, 86) |