Electronic & Electrochemical Materials

GORE® SPEEDBOARD® C Prepreg


GORE SPEEDBOARD C Prepreg

GORE® SPEEDBOARD® C Prepreg materials are sheets of expanded PTFE impregnated with thermoset resins. The air space inside the expanded PTFE is replaced with resin, and the ePTFE membrane becomes the carrier or the delivery system for the resin. The resin flows, fills, and bonds during the lamination process in the same way as conventional glass-based prepreg.



END-OF-LIFE NOTICE

This is an end-of-life product. Gore will be discontinuing the manufacture and sale of GORE® SPEEDBOARD®, G610, G620, G630, and G410 dielectric materials. These materials should not be incorporated into any new designs or programs. For questions, please contact Gore.

Material Properties

Dielectric constant at 1 MHz–40 GHz

2.6

Loss tangent at 1 MHZ–40 GHz

0.004

Dielectric strength (V/mil)

>1,000

Glass transition temperature Tg (Celsius)

220

Resin content (%)

67-81

Color

Opaque tan

Flammability

UL-94V-0

Pressed thickness (mils)

(µm)

1.5, 2.0, 2.2, 3.4

(38, 51, 57, 86)