Electronic & Electrochemical Materials

Dielectric Materials

Dielectric Materials

Gore's family of composite organic dielectric materials for chip package substrates and printed circuit boards are found in applications throughout such industries as Telecommunications, Computing, Test and Measurement, Defense, and Aerospace.


END-OF-LIFE NOTICE

This is an end-of-life product. Gore will be discontinuing the manufacture and sale of GORE® SPEEDBOARD®, G610, G620, G630, and G410 dielectric materials. These materials should not be incorporated into any new designs or programs. For questions, please contact Gore.

 

Applications

GORE Prepregs Cavity PCBs
 		 Rigid Flex High Speed Multilayers Microvia PCB Outerlayers RF Modules Chip Packages
GORE SPEEDBOARD C Prepreg x x x x x

 
GORE SPEEDBOARD LF Prepreg x x

 

 

 

 

Material Properties

GORE Prepregs Dk
@ 3 GHz
 		 Df
@ 3 GHz
 		 Tg
(TMA)		 Laser Drill Throughput
(Compared to glass prepreg)
 		 Halogen Free Low Flow
GORE SPEEDBOARD C Prepreg 2.6 0.004 220 3X   Good
GORE SPEEDBOARD LF Prepreg 2.6 0.004 220     Best

GORE SPEEDBOARD C Prepreg
GORE® SPEEDBOARD® C Prepreg
GORE® SPEEDBOARD® C Prepreg materials are sheets of expanded PTFE impregnated with thermoset resins.

GORE SPEEDBOARD LF Prepreg
GORE® SPEEDBOARD® LF Prepreg
GORE® SPEEDBOARD® LF Prepreg is compatible with all commercial laminates. This product exhibits controlled X-Y resin flow in cavity and ridgid-flex designs.