GORE™ G630 Prepreg

GORE G630 Prepreg provides the best cost/performance solution for high frequency/high speed microvia modules and PCBs. This material offers improved electrical performance, crack resistance and laser drilling throughput compared to glass reinforced materials.

Product Attributes

Electrical

• Low loss (0.004) for signal traces and buried passives (reduced insertion and pass-band losses)
• Low Dk (2.6) provides faster signal speeds
• Stable Dk and loss (1 MHz-40 GHz)
• Superior thickness uniformity for controlled impedance layers

Reliability

• High Tg for high temperature resistance
• Micro-reinforced for superior crack resistance
  

Processing

• Laser drilling 3-5× faster than glass prepregs
• Standard desmear processing, plasma preferred 
•  Fills buried vias during lamination (design dependent)
• Controlled resin flow for cavity module designs
• Compatible with lead-free processes

High density

• Excellent surface planarization for fine lines
• Thinner dielectric layers for improved microvia aspect ratios and reduced substrate thickness and weight
• Smaller vias for increased design freedom
  

Typical Applications

• RF modules for WLAN, Bluetooth, and power amplifiers
• MCM, transceivers, and optical modules
• Microvia PCBs for high speed telecom and computing microvia PCBs