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Home > Products > Electronic & Electrochemical Materials > Dielectric Materials > GORE™ G620 Prepreg
GORE™ G620 Prepreg
 GORE G620 prepreg allows production of reliable, cost sensitive, chip-set substrate packages using standard build-up construction techniques. GORE G620 offers improved electrical performance, with reduced processing cost.
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Material Properties
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| Property |
Method |
Value* |
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Dielectric constant 3 GHz
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LCR Air Gap
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2.8
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Loss tangent 3 GHz
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LCR Air Gap
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0.015
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Glass transition temperature (Tg)
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TMA
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155°C
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Coefficient of thermal expansion (CTE )
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TMA (–55 to +125°C)
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55 ppm/°C (X, Y, Z)
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Flammability
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UL
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94 V-0
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Moisture absorption
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24-hr. immersion, 20° C
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0.1 % w/w
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Peel strength
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IPC TM650 Method 2.4.9
17 µm copper (1/2 oz) |
1.1 Kg/cm
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Pressed thicknesses
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IPC TM650 Method 2.4.38
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60 µm ( ‹60µ in development)
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* Typical properties are not specification limits, but nominal performance values
Substrate Reliability Information
| Item |
Test Method |
Condition |
Result |
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Preconditioning
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JEDEC JESD22-A113A Level 3
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30°C; 60% RH; followed by 3 reflows at 225°C
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Pass
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Thermal cycling
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JESD22-A104A Condition C
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3,000 cycles; –65°C to +155°C; air-to-air
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Pass
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Pressure cooker test
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JEDEC JESD22-A102C,D
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168 hrs; 15 psig; 121°C
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Pass
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High temperature storage (HST)
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JESD22-A103B
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150°C; 1,000 hrs
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Pass
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Highly Accelerated Temperature and Humidity (HAST)
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JEDEC JESD22-A101B
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130°C; 85% RH; 33.3 Psig, 96 hrs
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Pass
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Advantages
- Superior laser drilling speeds and quality
- Stable Dk and Df over a wide frequency range
- Excellent thickness control for superior power distribution impedance
- Proven moisture reliability
- Processes with standard build-up substrate package techniques
Typical Applications
- Traditional build-up style chip package substrates
- Flip chip and wirebond chip set substrates
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