W.L.Gore & Associates, Inc.
Electronic & Electrochemical Materials
GORE™ G410 Prepreg
GORE G410 Prepreg allows production of reliable, high performance, single-chip substrate packages using modified printed circuit board construction techniques. GORE G410 Prepreg delivers the high performance organic substrate at a reasonable cost.
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Typical Material Properties
| Property | Method | Value* |
|---|---|---|
| Dielectric constant 500 MHz | Split post resonant cavity | 3.4 |
| 10 GHz | Kent cavity | 3.4 |
| 40 GHz | DI Model 600T Open Resonator | 3.3 |
| Loss tangent 500 MHz | Split post resonant cavity | 0.008 |
| 10 GHz | Kent cavity | 0.008 |
| 40 GHz | DI Model 600T Open Resonator | 0.008 |
| Glass transition temperature (Tg) | TMA | 220°C |
| Coefficient of thermal expansion (CTE ) | TMA (–55 to +125°C) | 19 ppm/°C (X, Y, Z) |
| Thermal conductivity | (–67 to +257°F) ASTM E1530 at 20°C (68°F) | 0.46 W/mK |
| Flammability | UL | 94 V-0** |
| Tensile modulus | at 25°C (77°F) | 12.2 GPa |
| Moisture absorption | 24-hr. immersion, 20° C | 0.17 % w/w |
| Peel strength | IPC TM650 Method 2.4.9 17 µm copper (1/2 oz) | 0.6 Kg/cm |
| Pressed thickness | IPC TM650 Method 2.4.38 | 63 μm |
* Typical properties are not specification limits, but nominal performance values
** Tested to UL flammability requirements by an independent lab
Substrate Reliability Information
| Item | Test Method | Condition | Result |
|---|---|---|---|
| Preconditioning | JEDEC JESD22-A113A Level 3 | 30°C; 60% RH; followed by 3 reflows at 225°C | Pass |
| Thermal shock | JESD22-A106A Condition C | 15 cycles; –55°C to +125°C; liquid-to-liquid | Pass |
| Thermal cycling | JESD22-A104A Condition B | 3,000 cycles; –55°C to +125°C; air-to-air | Pass |
| Pressure cooker test | JEDEC JESD22-A102B | 168 hrs; 15 psig; 121°C | Pass |
| High temperature storage | JESD22-A103A | 150°C; 1,000 hrs | Pass |
| Temperature humidity bias (THB) | JEDEC JESD22-A101A | 85°C; 85% RH; 1,000 hrs; 5 V bias | Pass |
| Solderability | MIL-STD-883 Method 2003 | 8 hrs steam aging; followed by immersion in solder | Pass |
| HAST | JESD22-A110A | 130°C; 85% RH; 5 V; 96 hrs | Pass |
Advantages
- Excellent dimensional stability for fine line processing
- Stable Dk and Df over a wide frequency range
- CTE matched to copper in X, Y, and Z-axis, allowing high aspect ratio vias
- Superior thickness control for superior power distribution impedance
- Proven moisture reliability
- High Tg (225°C)
- Processes with standard PWB techniques