|
Home > Products > Electronic & Electrochemical Materials > Dielectric Materials > GORE™ G410 Prepreg
GORE™ G410 Prepreg
GORE G410 Prepreg allows production of reliable, high performance, single-chip substrate packages using modified printed circuit board construction techniques. GORE G410 Prepreg delivers the high performance organic substrate at a reasonable cost.
| Typical Material Properties |
| Property |
Method |
Value* |
|
Dielectric constant 500 MHz
|
Split post resonant cavity
|
3.4
|
|
10 GHz
|
Kent cavity
|
3.4
|
|
40 GHz
|
DI Model 600T Open Resonator
|
3.3
|
|
Loss tangent 500 MHz
|
Split post resonant cavity
|
0.008
|
|
10 GHz
|
Kent cavity
|
0.008
|
|
40 GHz
|
DI Model 600T Open Resonator
|
0.008
|
|
Glass transition temperature (Tg)
|
TMA
|
220°C
|
|
Coefficient of thermal expansion (CTE )
|
TMA (–55 to +125°C)
|
19 ppm/°C (X, Y, Z)
|
|
Thermal conductivity
|
(–67 to +257°F)
ASTM E1530 at 20°C (68°F)
|
0.46 W/mK
|
|
Flammability
|
UL
|
94 V-0**
|
|
Tensile modulus
|
at 25°C (77°F)
|
12.2 GPa
|
|
Moisture absorption
|
24-hr. immersion, 20° C
|
0.17 % w/w
|
|
Peel strength
|
IPC TM650 Method 2.4.9
17 µm copper (1/2 oz)
|
0.6 Kg/cm
|
|
Pressed thickness
|
IPC TM650 Method 2.4.38
|
63 μm
|
* Typical properties are not specification limits, but nominal performance values
** Tested to UL flammability requirements by an independent lab
Substrate Reliability Information
| Item |
Test Method |
Condition |
Result |
|
Preconditioning
|
JEDEC JESD22-A113A Level 3
|
30°C; 60% RH; followed by 3 reflows at 225°C
|
Pass
|
|
Thermal shock
|
JESD22-A106A Condition C
|
15 cycles; –55°C to +125°C; liquid-to-liquid
|
Pass
|
|
Thermal cycling
|
JESD22-A104A Condition B
|
3,000 cycles; –55°C to +125°C; air-to-air
|
Pass
|
|
Pressure cooker test
|
JEDEC JESD22-A102B
|
168 hrs; 15 psig; 121°C
|
Pass
|
|
High temperature storage
|
JESD22-A103A
|
150°C; 1,000 hrs
|
Pass
|
|
Temperature humidity bias (THB)
|
JEDEC JESD22-A101A
|
85°C; 85% RH; 1,000 hrs; 5 V bias
|
Pass
|
|
Solderability
|
MIL-STD-883 Method 2003
|
8 hrs steam aging; followed by immersion in solder
|
Pass
|
|
HAST
|
JESD22-A110A
|
130°C; 85% RH; 5 V; 96 hrs
|
Pass
|
Advantages
- Excellent dimensional stability for fine line processing
- Stable Dk and Df over a wide frequency range
- CTE matched to copper in X, Y, and Z-axis, allowing high aspect ratio vias
- Superior thickness control for superior power distribution impedance
- Proven moisture reliability
- High Tg (225°C)
- Processes with standard PWB techniques
|
|
