Electronic & Electrochemical Materials

GORE™ G410 Prepreg


GORE G410 Prepreg

GORE G410 Prepreg allows production of reliable, high performance, single-chip substrate packages using modified printed circuit board construction techniques. GORE G410 Prepreg delivers the high performance organic substrate at a reasonable cost.



Typical Material Properties

Property Method Value*
Dielectric constant 500 MHz Split post resonant cavity 3.4
10 GHz Kent cavity 3.4
40 GHz DI Model 600T Open Resonator 3.3
Loss tangent 500 MHz Split post resonant cavity 0.008
10 GHz Kent cavity 0.008
40 GHz DI Model 600T Open Resonator 0.008
Glass transition temperature (Tg) TMA 220°C
Coefficient of thermal expansion (CTE ) TMA (–55 to +125°C) 19 ppm/°C (X, Y, Z)
Thermal conductivity (–67 to +257°F) ASTM E1530 at 20°C (68°F) 0.46 W/mK
Flammability UL 94 V-0**
Tensile modulus at 25°C (77°F) 12.2 GPa
Moisture absorption 24-hr. immersion, 20° C 0.17 % w/w
Peel strength IPC TM650 Method 2.4.9 17 µm copper (1/2 oz) 0.6 Kg/cm
Pressed thickness IPC TM650 Method 2.4.38 63 μm

* Typical properties are not specification limits, but nominal performance values
** Tested to UL flammability requirements by an independent lab


Substrate Reliability Information

Item Test Method Condition Result
Preconditioning JEDEC JESD22-A113A Level 3 30°C; 60% RH; followed by 3 reflows at 225°C Pass
Thermal shock JESD22-A106A Condition C 15 cycles; –55°C to +125°C; liquid-to-liquid Pass
Thermal cycling JESD22-A104A Condition B 3,000 cycles; –55°C to +125°C; air-to-air Pass
Pressure cooker test JEDEC JESD22-A102B 168 hrs; 15 psig; 121°C Pass
High temperature storage JESD22-A103A 150°C; 1,000 hrs Pass
Temperature humidity bias (THB) JEDEC JESD22-A101A 85°C; 85% RH; 1,000 hrs; 5 V bias Pass
Solderability MIL-STD-883 Method 2003 8 hrs steam aging; followed by immersion in solder Pass
HAST JESD22-A110A 130°C; 85% RH; 5 V; 96 hrs Pass

Advantages

  • Excellent dimensional stability for fine line processing
  • Stable Dk and Df over a wide frequency range
  • CTE matched to copper in X, Y, and Z-axis, allowing high aspect ratio vias
  • Superior thickness control for superior power distribution impedance
  • Proven moisture reliability
  • High Tg (225°C)
  • Processes with standard PWB techniques