GORE™ Secure Encapsulated Module
The GORE™ Secure Encapsulated Module is targeted to meet the requirements of the highest level of volume protection as specified in FIPS 140-2, Level 4. The folding technique used is designed to provide complete coverage of all surfaces (360° coverage). GORE™ Tamper Respondent Technology offers secure, yet easy-to-adopt solutions to volume tamper protection.
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How to Buy
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The GORE™ Secure Encapsulated Module detects physical intrusions by sensing attempts to open, remove, or penetrate the envelope covering the module. Detection typically triggers erasure of critical security information such as cryptographic keys or sensitive algorithms. The sensor is extremely low power and, being non-metallic, is impossible to analyze by X-ray. It is designed to detect penetration by drills and probes as well as by erosive and chemical attacks.
The GORE™ Secure Encapsulated Module is targeted to meet the requirements of FIPS 140-2, Level 4, DoD, NSA Type 1, and CESG Enhanced Grade security.
Features and Benefits
- Provides anti-tamper volume protection in a convenient form factor
- Enclosure acts as a tamper sensor that enables zeroization of critical keys or information stored within the protected volume
- Attempted penetration (cutting, drilling) or unwrapping causes detectable permanent change in electrical state
- All-polymer sensor construction precludes X-ray analysis by an attacker
- Easy to monitor with low power consumption
- OEM needs only simple design rules
- From the only commercial supplier of protection of secure electronics having many independent certifications
- Generic offering protects a 76mm x 80mm PCB—Other sizes available
- Targeted at FIPS 140-2, Level 4, DoD, NSA Type 1 security and CESG Enhanced Grade security