Cables & Cable Assemblies

GORE™ Space Cables and Assemblies: LVDS Interconnects

LVDS Interconnects

Increase Data Integrity Among Electrical Systems

Data integrity is key to maintaining communication among spacecraft systems during a mission. The cables that connect the systems have a direct impact on the quality of the data and the speed of transmission. GORE™ Low Voltage Differential Signaling (LVDS) Interconnects offer the best signal integrity because of the combination of their robust design and their outstanding electrical performance.

 


GORE™ LVDS Interconnects reduce time delay and skew of signal transmission, while consuming less power and minimizing electromagnetic interference. Their small size and minimum bending radius allow for easy installation in tight spaces. Their light weight decreases mass, thereby reducing the amount of energy needed to launch the vehicle into space. The high number of individual lines available in each bundle increases the cable’s flexibility and makes it easier to route the cable.

The Science Behind the Cables

The key to the outstanding performance of GORE™ LVDS Interconnects is the proprietary material used in the cable insulation — expanded polytetrafluoroethylene (ePTFE). This unique insulation provides excellent signal control for applications where tight impedance control is necessary. Expanded PTFE is both chemically inert and thermally stable, which allows GORE™ LVDS Interconnects to be used in tight spaces without compromising the strength and quality of signal transmission.

Typical Uses

  • Narrow-band interconnections
  • Interbox connections
  • Wideband interconnections

Sample Applications

  • INMARSAT4
  • SKYNET5
  • China Satellite

Key Features

  • Tightest 100 ohm impedance of individual signal pairs
  • Low signal attenuation and crosstalk
  • Good EMC performance
  • Twinax design based on ESA 3902/002
  • Multiple connector options
  • Frequencies up to 3 Gbit/s range
  • Vibration- and shock-resistant through QTP performance

Key Benefits

  • Excellent signal integrity, minimum noise, tight impedance control, and outstanding EMC performance
  • High transmission speed from synchronously matched interfaces
  • Outstanding clock synchronization between individual lines that distribute time-sensitive signals
  • Easier installation resulting from small size and tighter bending radius
  • Valued reliability delivered from an ESA-qualified and a DIN EN ISO 9001:2000-certified manufacturing facility
  • Superior sales and technical support from Gore’s worldwide engineering team

Technical Specifications

All GORE™ LVDS Interconnects meet the following technical specifications. See the ordering information for the technical data specific to each interconnect.

Property Value
Operating temperature range -200°C to +180°C
Maximum temperature for short periods 260°C
Outer jacket PFA
Conductor construction Concentric silver-plated copper
Operating voltage 200 V RMS
Impedance 100 ohms ± 4 ohms
Bending radius 10 x outer diameter (repeated) or 6 x outer diameter (once)
Transmission Rate Up to 3 Gbit/s
Maximum time delay (pair) 4.30 nsec/m 
Maximum conductor time delay difference 0.1 nsec/m 
Maximum capacitance: conductor to conductor 47 pF/m 
Maximum capacitance: conductor to shield 79 pF/m 

Ordering Information

Part Number Gauge Size
(AWG)		 Outer Diameter
(mm)		 Weight
(g/m)		 Typical Loss - Attenuation at 100 Meters (in dB)
20 MHz 100 MHz 400 MHz 600 MHz 1,000 MHz 
GSC-05-82561-00 22 5.2 37.0 9 20 39 48 63
GSC-05-82559-00 24 4.3 26.0 11 25 49 61 79
GSC-05-81973-00 26 3.1 18.0 17 36 68 83 108
GSC-05-82560-00 28 2.8 17.0 20 43 85 104 135
GSC-05-82292-00 30 2.2 13.5 25 54 107 131 169

The information given herein is based on data believed to be reliable. However, W. L. Gore & Associates makes no warranties, expressed or implied, as to its accuracy and assumes no liability arising out of its use by others. This publication is not to be taken as a license to operate or as a recommendation to infringe patents.