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GORE™ Assemblies for Tektronix Equipment

Extend Your Reach, Ease Your Mind

Today's high performance components are getting more complex, requiring more precise testing.  Compressed schedules mean your testing has to be accurate and dependable the first time, every time.  GORE™ High Performance RF Assemblies provide this assurance and complement your high performance Tektronix sampling modules and oscilloscopes.  Engineered to be stable and repeatable, these assemblies will provide the flexibility and performance you need to test your most complex devices, absolutely minimizing the impact on the signal under test.

Benchtop Test Assemblies are ideal for connecting your DUT to the module (or SIU, if used), because the signal is not distorted with assembly movement due to the enhanced and guaranteed stability with flexure.  Interconnect Assemblies can be used to connect the module to the SIU, if used in your test set-up.  The connectors on these assemblies are fully compatible with those on the appropriate sampling module.  All assemblies can be used to perform single-ended testing; and if required, Gore can phasematch assemblies to meet your differential testing needs.  To discuss your exact requirements, or to purchase assemblies, please contact Gore.

Note: This list is not all-inclusive.  GORE™ cable assemblies will complement the performance of any Tektronix CSA, TDS, or DPO digital oscilloscope.  For units equipped with Tektronix's propriety TekConnect front panel connector, they can be fitted with a TekConnect-to-SMA adapter (available from Tektronix) which will allow the use of standard assemblies available below.

Benchtop Test Assemblies

These assemblies are highly recommended for all benchtop test applications and are well suited to mate to the DUT.

Interconnect Assemblies

These assemblies are recommended for use to connect the sampling module to the Static Isolation Unit (if used), or to connect straight to the DUT.