High Data Rate Board-to-Board Interconnects
Gore offers high data rate digital cable assemblies that handle signal data rates up to 10 GHz with increased packaging density (0.120 in. signal-to-signal spacing). These cables are used in extremely demanding applications, such as ATE test heads, and are often designed into applications where clock speeds are doubling. These low loss coaxial assemblies are available as single lines or ganged into housings. Small and flexible, these assemblies minimize cable bundle sizes, allowing for simplified routing. Assemblies maintaining ±1 ohm impedance and signal skews within ±25 picoseconds are available.
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UHD Interconnect Builder
Receive a free quote using our Ultra High Density Interconnect Builder. This interactive application provides step-by-step instructions to build a UHD Interconnect Assembly.
Connector Options
Many connector options are available to meet specific application requirements. In addition to a precision SMA connector, Gore offers a fully shielded, custom housing capability with flexible pinouts. Gore also provides cable assemblies with spring probes to interface directly with the DUT board within an ATE test head. These cables can operate in a vacuum environment, and the spring probes are field replaceable, with variable signal spacing as close as 0.136 in.
- 6 GHz Coaxial Spring Probe Assemblies
- GORE™ Coaxial Spring Probe Assemblies provide controlled electrical performance for high-speed test and measurement applications.
- Ultra High Density Interconnects
- GORE™ Ultra High Density (UHD) Interconnects provide an integrated system of board mount headers and ganged cable assemblies with reliable signal integrity performance.