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Increasing Design Flexibility for Board-Level Shielding


Article Reprint from the 2009 Interference Technology EMC Directory and Design Guide

This article, featured in the 2009 Interference Technology EMC Directory & Design Guide, reviews board-level shielding options for the design of printed circuit boards (PCBs). The author compares thermoformed, multi-cavity, board-level shields with traditional shielding cans, and discusses the benefits of board-level shields for optimal designs that maximizes space usage and functionality.


Download the Article (1.37 MB PDF)